| 11257801 |
Stacked semiconductor package having mold vias and method for manufacturing the same |
Sang Eun Lee, Hyung-Dong Lee |
2022-02-22 |
| 10418353 |
Stacked semiconductor package having mold vias and method for manufacturing the same |
Sang Eun Lee, Hyung-Dong Lee |
2019-09-17 |
| 10002850 |
Semiconductor chip flexibly applied to various routing structures and semiconductor chip module using the same |
Sang Eun Lee, Yong Jae Park |
2018-06-19 |
| 9966359 |
Semiconductor package embedded with a plurality of chips |
Sang Eun Lee, Yong Jae Park |
2018-05-08 |
| 9780071 |
Stacked semiconductor package including reconfigurable package units |
Sang Eun Lee, Yong Jae Park |
2017-10-03 |
| 9711482 |
Semiconductor package embedded with plurality of chips and method of manufacturing the same |
Sang Eun Lee, Yong Jae Park |
2017-07-18 |
| 9607667 |
Memory device and electronic apparatus including the same |
Sang Eun Lee |
2017-03-28 |