Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716017 | Semiconductor packages including interposer and methods of manufacturing the same | Seung Taek YANG | 2017-07-25 |
| 9570370 | Multi chip package and method for manufacturing the same | Jong Hoon Kim, Ho Young SON, Jeong-Hwan Lee | 2017-02-14 |
| 9508699 | Semiconductor package and method for manufacturing the same | Jong Hoon Kim, Jeong-Hwan Lee | 2016-11-29 |
| 9406584 | Semiconductor package and method for manufacturing the same | Jeong-Hwan Lee | 2016-08-02 |
| 9299689 | Methods of fabricating semiconductor stack packages | — | 2016-03-29 |
| 9257413 | Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same | Seung Taek YANG, Jong Hoon Kim, Song NA | 2016-02-09 |
| 8803327 | Semiconductor package | — | 2014-08-12 |
| 8669642 | Semiconductor chip and fabricating method thereof | Ho Young SON | 2014-03-11 |
| 8624241 | Semiconductor chip, stack-type semiconductor package | — | 2014-01-07 |
| 8618656 | Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same | Sung Min Kim | 2013-12-31 |
| 8338921 | Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same | Chang Jun Park, Kwon Whan Han, Seong Cheol Kim, Sung Min Kim, Hyeong-Seok Choi +2 more | 2012-12-25 |
| 8198136 | Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same | — | 2012-06-12 |
| 8049332 | Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same | Sung Min Kim | 2011-11-01 |
| 7838979 | Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same | — | 2010-11-23 |