Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11501981 | Methods for fabricating semiconductor packages by using a mold press with an upper chase and a lower chase | Kyung Beom SEO, Jong Kyu MOON, Jong Hyock PARK | 2022-11-15 |
| 9257413 | Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same | Seung Taek YANG, Jong Hoon Kim, Tac Keun OH | 2016-02-09 |