Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11501981 | Methods for fabricating semiconductor packages by using a mold press with an upper chase and a lower chase | Jong Kyu MOON, Jong Hyock PARK, Song NA | 2022-11-15 |
| 9758654 | Polypropylene resin composition and interior and exterior materials for vehicles using the same | Kyeong Hoon Jang, Dae-sik Kim, Han Ki Lee, Hak Soo Kim, Jung Gyun Noh +2 more | 2017-09-12 |
| 9139725 | Polypropylene resin composition for interior materials of automobile with advanced paint adhesivity and low specific gravity | Jung Gyun Noh, Kyeong Hoon Jang, Hak Soo Kim, Han Ki Lee, Han Pyol Kim +1 more | 2015-09-22 |