Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11822571 | Systems and methods for managing event storage | — | 2023-11-21 |
| 11593742 | Systems and method for workflow editing | — | 2023-02-28 |
| 11270923 | Semiconductor packages including a heat insulation wall | Min-Kyu Kang, Ji Hyeok Shin | 2022-03-08 |
| 11256714 | Systems and methods for managing event storage | — | 2022-02-22 |
| 11080636 | Systems and method for workflow editing | — | 2021-08-03 |
| 10600713 | Semiconductor packages including a heat insulation wall | Min-Kyu Kang, Ji Hyeok Shin | 2020-03-24 |
| 9390997 | Semiconductor chip and stacked type semiconductor package having the same | Jong Hoon Kim, Byoung Do Lee, Kuk-jin Chun, Woong Kyu Choi | 2016-07-12 |
| 8810309 | Stack package and method for selecting chip in stack package | Dae Woong Lee, Yu Gyeong Hwang, Tae-Min Kang, Chul Keun Yoon, Byoung Do Lee +1 more | 2014-08-19 |
| 8680688 | Stack package having flexible conductors | Tae-Min Kang, You Kyung Hwang, Dae Woong Lee, Byoung Do Lee, Yu Hwan Kim | 2014-03-25 |
| 8523158 | Opener and buffer table for test handler | Yun-Sung Na, In-Gu Jeon, Seung-Chul Ahn, Dong-Han Kim | 2013-09-03 |
| 8496113 | Insert for carrier board of test handler | Yun-Sung Na, Tae-Hung Ku, Dong-Han Kim, Young-Yong Kim | 2013-07-30 |
| 8288873 | Stack package having flexible conductors | Tae-Min Kang, You Kyung Hwang, Dae Woong Lee, Byoung Do Lee, Yu Hwan Kim | 2012-10-16 |
| 8164200 | Stack semiconductor package and method for manufacturing the same | Tae-Min Kang, You Kyung Hwang, Dae Woong Lee, Chul Keun Yoon, Byoung Do Lee +1 more | 2012-04-24 |
| 8044301 | Printed circuit board provided with heat circulating medium and method for manufacturing the same | — | 2011-10-25 |