Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9802251 | Ni ball, Ni core ball, solder joint, solder paste, and solder foam | Hiroyoshi Kawasaki, Takashi Akagawa, Atsushi Ikeda, Masaru Sasaki, Takahiro Roppongi +2 more | 2017-10-31 |
| 9266196 | Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste | Takashi Akagawa, Hiroyoshi Kawasaki, Kazuhiko Matsui, Masaru Sasaki, Hiroyuki Yamasaki +3 more | 2016-02-23 |