Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10843886 | Friction shaft for slitter | Soo Hyung Lee | 2020-11-24 |
| 10829339 | Friction shaft for slitter | Soo Hyung Lee | 2020-11-10 |
| 10568814 | Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base | — | 2020-02-25 |
| 10357435 | Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base | — | 2019-07-23 |
| 10157823 | High density fan out package structure | Dong Wook Kim, Hong Bok We, Shiqun Gu | 2018-12-18 |
| 10049977 | Semiconductor package on package structure and method of forming the same | Hong Bok We, Dong Wook Kim, Kyu-Pyung Hwang, Young Kyu Song | 2018-08-14 |
| 9881859 | Substrate block for PoP package | Hong Bok We, Dong Wook Kim, Shiqun Gu, Ratibor Radojcic | 2018-01-30 |
| 9799628 | Stacked package configurations and methods of making the same | Dong Wook Kim, Hong Bok We, Shiqun Gu | 2017-10-24 |
| 9675432 | Method and apparatus for preparing removable dental prosthesis | Tae Hyung Kim, Sun Young Kwon | 2017-06-13 |
| 9679855 | Polymer crack stop seal ring structure in wafer level package | Hong Bok We, Dong Wook Kim, Jon Aday | 2017-06-13 |
| 9633950 | Integrated device comprising flexible connector between integrated circuit (IC) packages | Hong Bok We, Dong Wook Kim | 2017-04-25 |
| 9613942 | Interposer for a package-on-package structure | Kyu-Pyung Hwang, Hong Bok We | 2017-04-04 |
| 9596768 | Substrate with conductive vias | Hong Bok We, Dong Wook Kim, Shiqun Gu | 2017-03-14 |
| 9595494 | Semiconductor package with high density die to die connection and method of making the same | Hong Bok We, Dong Wook Kim | 2017-03-14 |
| 9595496 | Integrated device package comprising silicon bridge in an encapsulation layer | Hong Bok We, Dong Wook Kim, Shiqun Gu | 2017-03-14 |
| 9583462 | Damascene re-distribution layer (RDL) in fan out split die application | Hong Bok We, Dong Wook Kim | 2017-02-28 |
| 9472425 | Power distribution improvement using pseudo-ESR control of an embedded passive capacitor | Young Kyu Song, Kyu-Pyung Hwang | 2016-10-18 |
| 9466554 | Integrated device comprising via with side barrier layer traversing encapsulation layer | Hong Bok We, Dong Wook Kim, Shiqun Gu | 2016-10-11 |
| 9456963 | Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base | — | 2016-10-04 |
| 9443824 | Cavity bridge connection for die split architecture | Hong Bok We, Dong Wook Kim | 2016-09-13 |
| 9418877 | Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers | Shiqun Gu, Ratibor Radojcic, Dong Wook Kim | 2016-08-16 |
| 9401350 | Package-on-package (POP) structure including multiple dies | Hong Bok We, Dong Wook Kim, Shiqun Gu | 2016-07-26 |
| 9368450 | Integrated device package comprising bridge in litho-etchable layer | Shiqun Gu, Hong Bok We, Dong Wook Kim | 2016-06-14 |
| 9355963 | Semiconductor package interconnections and method of making the same | Dong Wook Kim, Hong Bok We, Young Kyu Song, Chin-Kwan Kim, Kyu-Pyung Hwang +1 more | 2016-05-31 |
| 9269610 | Pattern between pattern for low profile substrate | Hong Bok We, Chin-Kwan Kim, Dong Wook Kim, Kyu-Pyung Hwang, Young Kyu Song | 2016-02-23 |