Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12016164 | RF filter device for aircraft nacelle access door gap | Kyu-Pyung Hwang, Thomas D. Mitchum, Jr., Philipp A. Boettcher | 2024-06-18 |
| 11462460 | Electrical module assembly with embedded dies | Kyu-Pyung Hwang | 2022-10-04 |
| 11378605 | Method for high-intensity radiated field (HIRF) and electromagnetic pulse (EMP) analysis of a vehicle | Kyu-Pyung Hwang | 2022-07-05 |
| 11191983 | Fire suppressing device | Kyu-Pyung Hwang | 2021-12-07 |
| 11071213 | Methods of manufacturing a high impedance surface (HIS) enhanced by discrete passives | Charles Muwonge, Kyu-Pyung Hwang, Terry R. Vogler | 2021-07-20 |
| 11038277 | High impedance surface (HIS) enhanced by discrete passives | Charles Muwonge, Kyu-Pyung Hwang, Terry R. Vogler | 2021-06-15 |
| 10980122 | Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance | Kyu-Pyung Hwang | 2021-04-13 |
| 10903542 | Variable radio frequency attenuator | Walid M. Al-Bondak, Kyu-Pyung Hwang | 2021-01-26 |
| 10879341 | Integrated device package comprising a real time tunable inductor implemented in a package substrate | Sangjo Choi, Jong-Hoon Lee, Paragkumar Ajaybhai Thadesar | 2020-12-29 |
| 10653013 | Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance | Kyu-Pyung Hwang | 2020-05-12 |
| 10471679 | Metal graphic and method to produce a metal graphic | Robert Lyn | 2019-11-12 |
| 10304623 | Integrated device package comprising a tunable inductor | John Jong-Suk Lee, Sangjo Choi | 2019-05-28 |
| 10256863 | Monolithic integration of antenna switch and diplexer | Shiqun Gu, Chengjie Zuo, Steve Fanelli, Thomas A. Gee | 2019-04-09 |
| 10181410 | Integrated circuit package comprising surface capacitor and ground plane | Kyu-Pyung Hwang, Hong Bok We | 2019-01-15 |
| 10109584 | Patterned grounds and methods of forming the same | Uei-Ming Jow, Jung Ho Yoon, Jong-Hoon Lee, Xiaonan Zhang | 2018-10-23 |
| 10079097 | Capacitor structure for power delivery applications | Hong Bok We, Kyu-Pyung Hwang | 2018-09-18 |
| 10049977 | Semiconductor package on package structure and method of forming the same | Hong Bok We, Dong Wook Kim, Jae Sik Lee, Kyu-Pyung Hwang | 2018-08-14 |
| 10051741 | Embedded layered inductor | Daeik Daniel Kim, Xiaonan Zhang, Ryan David Lane, Jonghae Kim | 2018-08-14 |
| 9933455 | Known good die testing for high frequency applications | Kyu-Pyung Hwang | 2018-04-03 |
| 9875997 | Low profile reinforced package-on-package semiconductor device | Hong Bok We, Dong Wook Kim, Kyu-Pyung Hwang | 2018-01-23 |
| 9837209 | Capacitor structure for wideband resonance suppression in power delivery networks | Kyu-Pyung Hwang, Changhan Hobie Yun, Dong Wook Kim | 2017-12-05 |
| 9812752 | Flip-chip employing integrated cavity filter, and related components, systems, and methods | John Jong-Suk Lee, Uei-Ming Jow, Sangjo Choi, Xiaonan Zhang | 2017-11-07 |
| 9806144 | Solenoid inductor in a substrate | Daeik Daniel Kim, Xiaonan Zhang, Jonghae Kim | 2017-10-31 |
| 9807884 | Substrate comprising embedded elongated capacitor | Kyu-Pyung Hwang | 2017-10-31 |
| 9691694 | Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate | Uei-Ming Jow, Jong-Hoon Lee, Xiaonan Zhang, Mario Francisco Velez | 2017-06-27 |