Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691720 | Multi-layer ground shield structure of interconnected elements | Uei-Ming Jow, Jong-Hoon Lee | 2017-06-27 |
| 9659850 | Package substrate comprising capacitor, redistribution layer and discrete coaxial connection | Hong Bok We, Kyu-Pyung Hwang, Dong Wook Kim | 2017-05-23 |
| 9653533 | Multi-layer interconnected spiral capacitor | Uei-Ming Jow, Jong-Hoon Lee, Xiaonan Zhang | 2017-05-16 |
| 9628052 | Embedded multi-terminal capacitor | Hong Bok We, Dong Wook Kim, Kyu-Pyung Hwang | 2017-04-18 |
| 9583433 | Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer | Hong Bok We, Kyu-Pyung Hwang | 2017-02-28 |
| 9576718 | Inductor structure in a semiconductor device | Uei-Ming Jow, Jong-Hoon Lee, Jung Ho Yoon, Sangjo Choi, Xiaonan Zhang | 2017-02-21 |
| 9530739 | Package on package (PoP) device comprising a high performance inter package connection | Kyu-Pyung Hwang | 2016-12-27 |
| 9502491 | Embedded sheet capacitor | Kyu-Pyung Hwang, Dong Wook Kim, Changhan Hobie Yun | 2016-11-22 |
| 9502490 | Embedded package substrate capacitor | Hong Bok We, Kyu-Pyung Hwang, Dong Wook Kim | 2016-11-22 |
| 9490226 | Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal | Hong Bok We, Dong Wook Kim, Kyu-Pyung Hwang | 2016-11-08 |
| 9472425 | Power distribution improvement using pseudo-ESR control of an embedded passive capacitor | Kyu-Pyung Hwang, Jae Sik Lee | 2016-10-18 |
| 9449762 | Embedded package substrate capacitor with configurable/controllable equivalent series resistance | Kyu-Pyung Hwang, Dong Wook Kim, Xiaonan Zhang, Ryan David Lane | 2016-09-20 |
| 9443810 | Flip-chip employing integrated cavity filter, and related components, systems, and methods | John Jong-Suk Lee, Uei-Ming Jow, Sangjo Choi, Xiaonan Zhang | 2016-09-13 |
| 9425143 | Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield | Kyu-Pyung Hwang | 2016-08-23 |
| 9385077 | Integrated device comprising coaxial interconnect | Dong Wook Kim, Kyu-Pyung Hwang, Hong Bok We | 2016-07-05 |
| 9373583 | High quality factor filter implemented in wafer level packaging (WLP) integrated device | Jong-Hoon Lee, Jung Ho Yoon, Uei-Ming Jow, Xiaonan Zhang, Ryan David Lane | 2016-06-21 |
| 9368566 | Package on package (PoP) integrated device comprising a capacitor in a substrate | Jong-Hoon Lee, Daeik Daniel Kim, Jung Ho Yoon, Uei-Ming Jow, Mario Francisco Velez +3 more | 2016-06-14 |
| 9362218 | Integrated passive device (IPD) on substrate | Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim +2 more | 2016-06-07 |
| 9355963 | Semiconductor package interconnections and method of making the same | Dong Wook Kim, Jae Sik Lee, Hong Bok We, Chin-Kwan Kim, Kyu-Pyung Hwang +1 more | 2016-05-31 |
| 9335384 | Adjustable magnetic probe for efficient near field scanning | Kyu-Pyung Hwang, Dong Wook Kim, Changhan Hobie Yun | 2016-05-10 |
| 9324779 | Toroid inductor in an integrated device | Daeik Daniel Kim, Jonghae Kim, Xiaonan Zhang, Ryan David Lane, Mario Francisco Velez +2 more | 2016-04-26 |
| 9294064 | Bandpass filter implementation on a single layer using spiral capacitors | Kyu-Pyung Hwang, Changhan Hobie Yun, Dong Wook Kim | 2016-03-22 |
| 9275876 | Stiffener with embedded passive components | Dong Wook Kim, Kyu-Pyung Hwang, Changhan Hobie Yun | 2016-03-01 |
| 9269610 | Pattern between pattern for low profile substrate | Hong Bok We, Chin-Kwan Kim, Dong Wook Kim, Jae Sik Lee, Kyu-Pyung Hwang | 2016-02-23 |
| 9245940 | Inductor design on floating UBM balls for wafer level package (WLP) | Yunseo Park, Xiaonan Zhang, Ryan David Lane, Aristotele Hadjichristos | 2016-01-26 |