Issued Patents All Time
Showing 51–58 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9247647 | High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB) | Jung Ho Yoon, Xiaonan Zhang, Jong-Hoon Lee, Uei-Ming Jow | 2016-01-26 |
| 9151779 | Reconfigurable electric field probe | Kyu-Pyung Hwang, Changhan Hobie Yun, Dong Wook Kim | 2015-10-06 |
| 9093295 | Embedded sheet capacitor | Kyu-Pyung Hwang, Dong Wook Kim, Changhan Hobie Yun | 2015-07-28 |
| 9041212 | Thermal design and electrical routing for multiple stacked packages using through via insert (TVI) | Dong Wook Kim, Victor A. Chiriac, Kyu-Pyung Hwang, Changhan Hobie Yun | 2015-05-26 |
| 9035421 | High quality factor inductor implemented in wafer level packaging (WLP) | Yunseo Park, Xiaonan Zhang, Ryan David Lane, Babak Nejati, Aristotele Hadjichristos +1 more | 2015-05-19 |
| 8987872 | Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages | Kyu-Pyung Hwang, Dong Wook Kim, Changhan Hobie Yun | 2015-03-24 |
| 7360675 | Wire bonder for ball bonding insulated wire and method of using same | John Persic, Morgan Upshall, Juan Florencio Munar | 2008-04-22 |
| 6896170 | Wire bonder for ball bonding insulated wire and method of using same | Robert Lyn, John Persic | 2005-05-24 |