Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402332 | Integrated passive devices | Changhan Hobie Yun, Nosun PARK, Daniel Daeik Kim, Sameer S. Vadhavkar, Vinay Prakash | 2025-08-26 |
| 12027476 | Package comprising substrate with coupling element for integrated devices | Fnu Suraj Prakash, John Jong-Suk Lee, Nikhil Raman, Peng Song, Francesco Carrara | 2024-07-02 |
| 12016247 | Package comprising an integrated passive device configured as a cap for a filter | Changhan Hobie Yun, Nosun PARK, Daniel Daeik Kim, Sameer S. Vadhavkar | 2024-06-18 |
| 12009292 | Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variation | Nosun PARK, Changhan Hobie Yun, Daniel Daeik Kim, Sameer S. Vadhavkar | 2024-06-11 |
| 11770115 | Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methods | Changhan Hobie Yun, Hannu Laurila, Ville Lehtisalo, Ville Herman Brunou, Daniel Daeik Kim +2 more | 2023-09-26 |
| 11728293 | Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component | Changhan Hobie Yun, Daniel Daeik Kim, Nosun PARK, Sameer S. Vadhavkar | 2023-08-15 |
| 11658403 | Device, package and/or substrate comprising curved antenna | Changhan Hobie Yun, Daniel Daeik Kim, Nosun PARK, Sameer S. Vadhavkar | 2023-05-23 |
| 11515247 | Capacitance fine tuning by fin capacitor design | Nosun PARK, Changhan Hobie Yun, Daniel Daeik Kim, Sameer S. Vadhavkar | 2022-11-29 |
| 11502652 | Substrate comprising capacitor configured for power amplifier output match | Daniel Daeik Kim, Changhan Hobie Yun, Sameer S. Vadhavkar, Nosun PARK | 2022-11-15 |
| 11239158 | Wire bond inductor structures for flip chip dies | Changhan Hobie Yun, Sameer S. Vadhavkar, Daniel Daeik Kim, Francesco Carrara | 2022-02-01 |
| 10879341 | Integrated device package comprising a real time tunable inductor implemented in a package substrate | Young Kyu Song, Sangjo Choi, Jong-Hoon Lee | 2020-12-29 |
| 10614942 | Inductors formed with through glass vias | Changhan Hobie Yun, Mario Francisco Velez, Nosun PARK, Wei-Chuan Chen, Niranjan Sunil Mudakatte +2 more | 2020-04-07 |
| 10490621 | Close proximity tunable inductive elements | Mario Francisco Velez, Changhan Hobie Yun, Francesco Carrara, Jonghae Kim, Xiaoju YU +1 more | 2019-11-26 |
| 10330874 | Mixed-signal substrate with integrated through-substrate vias | Muhannad Bakir | 2019-06-25 |