| 11024454 |
High performance inductors |
Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, Jonghae Kim, Chengjie Zuo +1 more |
2021-06-01 |
| 10944379 |
Hybrid passive-on-glass (POG) acoustic filter |
David Francis Berdy, Changhan Hobie Yun, Shiqun Gu, Mario Francisco Velez, Chengjie Zuo +1 more |
2021-03-09 |
| 10693432 |
Solenoid structure with conductive pillar technology |
Nosun PARK, Changhan Hobie Yun, Jonghae Kim, Xiaoju YU, Wei-Chuan Chen |
2020-06-23 |
| 10614942 |
Inductors formed with through glass vias |
Changhan Hobie Yun, Mario Francisco Velez, Nosun PARK, Wei-Chuan Chen, Xiaoju YU +2 more |
2020-04-07 |
| 10607980 |
Passive-on-glass (POG) device and method |
Je-Hsiung Lan, Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, David Francis Berdy +2 more |
2020-03-31 |
| 10582609 |
Integration of through glass via (TGV) filter and acoustic filter |
Changhan Hobie Yun, Jonghae Kim, Xiaoju YU, Mario Francisco Velez, Wei-Chuan Chen +7 more |
2020-03-03 |
| 10523253 |
Glass substrate including passive-on-glass device and semiconductor die |
Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Shiqun Gu, Jonghae Kim +1 more |
2019-12-31 |
| 10498307 |
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor |
Mario Francisco Velez, Jonghae Kim, Changhan Hobie Yun, David Francis Berdy, Shiqun Gu +1 more |
2019-12-03 |
| 10490348 |
Two-dimensional structure to form an embedded three-dimensional structure |
Mario Francisco Velez, Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim +3 more |
2019-11-26 |
| 10490621 |
Close proximity tunable inductive elements |
Paragkumar Ajaybhai Thadesar, Mario Francisco Velez, Changhan Hobie Yun, Francesco Carrara, Jonghae Kim +1 more |
2019-11-26 |
| 10332671 |
Solenoid inductor |
Mario Francisco Velez, Changhan Hobie Yun, Daeik Daniel Kim, David Francis Berdy, Jonghae Kim +2 more |
2019-06-25 |
| 10292269 |
Inductor with metal-insulator-metal (MIM) capacitor |
Changhan Hobie Yun, Jonghae Kim, Xiaoju YU, Nosun PARK, Mario Francisco Velez |
2019-05-14 |
| 10290414 |
Substrate comprising an embedded inductor and a thin film magnetic core |
Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Daeik Daniel Kim, David Francis Berdy +3 more |
2019-05-14 |
| 10187031 |
Tunable matching network |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more |
2019-01-22 |
| 10171112 |
RF multiplexer with integrated directional couplers |
Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more |
2019-01-01 |
| 10163771 |
Interposer device including at least one transistor and at least one through-substrate via |
Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Mario Francisco Velez, Shiqun Gu +1 more |
2018-12-25 |
| 10141908 |
Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance |
David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Shiqun Gu, Mario Francisco Velez +1 more |
2018-11-27 |
| 10103703 |
Double-sided circuit |
Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Jonghae Kim +2 more |
2018-10-16 |
| 10103116 |
Open-passivation ball grid array pads |
Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, Chengjie Zuo, David Francis Berdy +1 more |
2018-10-16 |
| 10103135 |
Backside ground plane for integrated circuit |
Chengjie Zuo, Jonghae Kim, David Francis Berdy, Changhan Hobie Yun, Mario Francisco Velez +1 more |
2018-10-16 |
| 10074625 |
Wafer level package (WLP) ball support using cavity structure |
Mario Francisco Velez, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim, Chengjie Zuo +3 more |
2018-09-11 |
| 10069474 |
Encapsulation of acoustic resonator devices |
Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez, Je-Hsiung Lan +4 more |
2018-09-04 |
| 10044390 |
Glass substrate including passive-on-glass device and semiconductor die |
Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Shiqun Gu, Jonghae Kim +1 more |
2018-08-07 |
| 10038422 |
Single-chip multi-frequency film bulk acoustic-wave resonators |
Changhan Hobie Yun, Je-Hsiung Lan, Chengjie Zuo, David Francis Berdy, Jonghae Kim +2 more |
2018-07-31 |
| 10026546 |
Apparatus with 3D wirewound inductor integrated within a substrate |
Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez, Jonghae Kim +1 more |
2018-07-17 |