| 12267099 |
Dynamic radio frequency loading change mitigation |
Jin Hoon Cho, Yu Zhao, Christian Holenstein, Ryan Scott Castro SPRING, Jose Cabanillas +1 more |
2025-04-01 |
| 11024454 |
High performance inductors |
Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Jonghae Kim +1 more |
2021-06-01 |
| 10944379 |
Hybrid passive-on-glass (POG) acoustic filter |
Changhan Hobie Yun, Shiqun Gu, Niranjan Sunil Mudakatte, Mario Francisco Velez, Chengjie Zuo +1 more |
2021-03-09 |
| 10903240 |
Integrated circuits (ICs) on a glass substrate |
Shiqun Gu, Daniel Daeik Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun +1 more |
2021-01-26 |
| 10607980 |
Passive-on-glass (POG) device and method |
Je-Hsiung Lan, Niranjan Sunil Mudakatte, Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo +2 more |
2020-03-31 |
| 10523253 |
Glass substrate including passive-on-glass device and semiconductor die |
Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Niranjan Sunil Mudakatte, Shiqun Gu +1 more |
2019-12-31 |
| 10498307 |
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor |
Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim, Changhan Hobie Yun, Shiqun Gu +1 more |
2019-12-03 |
| 10490348 |
Two-dimensional structure to form an embedded three-dimensional structure |
Mario Francisco Velez, Daeik Daniel Kim, Niranjan Sunil Mudakatte, Changhan Hobie Yun, Jonghae Kim +3 more |
2019-11-26 |
| 10361149 |
Land grid array (LGA) packaging of passive-on-glass (POG) structure |
Chengjie Zuo, Mario Francisco Velez, Changhan Hobie Yun, Daeik Daniel Kim, Jonghae Kim |
2019-07-23 |
| 10332911 |
Integrated circuits (ICs) on a glass substrate |
Shiqun Gu, Daeik Daniel Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun +1 more |
2019-06-25 |
| 10332671 |
Solenoid inductor |
Mario Francisco Velez, Niranjan Sunil Mudakatte, Changhan Hobie Yun, Daeik Daniel Kim, Jonghae Kim +2 more |
2019-06-25 |
| 10319694 |
Semiconductor assembly and method of making same |
Daniel Daeik Kim, Jie Fu, Manuel Aldrete, Jonghae Kim, Changhan Hobie Yun +2 more |
2019-06-11 |
| 10290414 |
Substrate comprising an embedded inductor and a thin film magnetic core |
Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan +3 more |
2019-05-14 |
| 10283257 |
Skewed co-spiral inductor structure |
Daeik Daniel Kim, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim |
2019-05-07 |
| 10249580 |
Stacked substrate inductor |
Daeik Daniel Kim, Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Jonghae Kim |
2019-04-02 |
| 10242957 |
Compartment shielding in flip-chip (FC) module |
Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim +1 more |
2019-03-26 |
| 10187031 |
Tunable matching network |
Yunfei Ma, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan +4 more |
2019-01-22 |
| 10171112 |
RF multiplexer with integrated directional couplers |
Yunfei Ma, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan +4 more |
2019-01-01 |
| 10163771 |
Interposer device including at least one transistor and at least one through-substrate via |
Chengjie Zuo, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez, Shiqun Gu +1 more |
2018-12-25 |
| 10154591 |
Passive device assembly for accurate ground plane control |
Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Jonghae Kim |
2018-12-11 |
| 10141353 |
Passive components implemented on a plurality of stacked insulators |
Changhan Hobie Yun, Daeik Daniel Kim, Jonghae Kim, Mario Francisco Velez, Chengjie Zuo |
2018-11-27 |
| 10141908 |
Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance |
Niranjan Sunil Mudakatte, Changhan Hobie Yun, Chengjie Zuo, Shiqun Gu, Mario Francisco Velez +1 more |
2018-11-27 |
| 10103703 |
Double-sided circuit |
Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Jonghae Kim, Mario Francisco Velez +2 more |
2018-10-16 |
| 10103116 |
Open-passivation ball grid array pads |
Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim +1 more |
2018-10-16 |
| 10103135 |
Backside ground plane for integrated circuit |
Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more |
2018-10-16 |