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Thermal paths for glass substrates |
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Solenoid structure with conductive pillar technology |
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Inductors formed with through glass vias |
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Integration of through glass via (TGV) filter and acoustic filter |
Changhan Hobie Yun, Jonghae Kim, Mario Francisco Velez, Wei-Chuan Chen, Niranjan Sunil Mudakatte +7 more |
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Close proximity tunable inductive elements |
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Inductor with metal-insulator-metal (MIM) capacitor |
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