Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027488 | Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the same | Mike Breeden, Victor Wang, Andrew C. Kummel, Ming Li, Jonathan Hollin +2 more | 2024-07-02 |
| 10636731 | Mechanically flexible interconnects, methods of making the same, and methods of use | Paul Kim Jo | 2020-04-28 |
| 10330874 | Mixed-signal substrate with integrated through-substrate vias | Paragkumar Ajaybhai Thadesar | 2019-06-25 |
| 8803509 | Modular nano and microscale sensors | Ramasamy Ravindran | 2014-08-12 |
| 8563365 | Air-gap C4 fluidic I/O interconnects and methods of fabricating same | Calvin Richard King, Jr., Jesal Zevari, James D. Meindl | 2013-10-22 |
| 8546930 | 3-D ICs equipped with double sided power, coolant, and data features | Gang Huang | 2013-10-01 |
| 7928563 | 3-D ICs with microfluidic interconnects and methods of constructing same | Deepak C. Sekar, Bing Dang, Calvin Richard King, Jr., James D. Meindl | 2011-04-19 |
| 7798817 | Integrated circuit interconnects with coaxial conductors | Paul A. Kohl, ATE HE, Mark G. Cupta, Todd M. Spencer | 2010-09-21 |
| 7554347 | High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use | Tony Mule, Hiren D. Thacker, James D. Meindl, Thomas K. Gaylord, Kevin P. Martin +1 more | 2009-06-30 |
| 7468558 | Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof | Kevin P. Martin, James D. Meindl | 2008-12-23 |
| 7266267 | Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereof | James D. Meindl | 2007-09-04 |
| 7135777 | Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof | James D. Meindl | 2006-11-14 |
| 7132736 | Devices having compliant wafer-level packages with pillars and methods of fabrication | James D. Meindl, Chirag S. Patel | 2006-11-07 |
| 7099525 | Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereof | Kevin P. Martin, James D. Meindl | 2006-08-29 |
| 6954576 | Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package | Tony Mule, Chirag S. Patel, James D. Meindl, Thomas K. Gaylord, Elias N. Glytsis +4 more | 2005-10-11 |
| 6788867 | Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication | Tony Mule, James D. Meindl, Paul A. Kohl, Stephen M. Schultz, Thomas K. Gaylord +3 more | 2004-09-07 |
| 6785458 | Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package | Tony Mule, Chirag S. Patel, James D. Meindl, Thomas K. Gaylord, Elias N. Glytsis +4 more | 2004-08-31 |
| 6690081 | Compliant wafer-level packaging devices and methods of fabrication | Hollie Reed, Paul A. Kohl, Chirag S. Patel, Kevin P. Martin, James D. Meindl | 2004-02-10 |