| 7649264 |
Hard mask for low-k interlayer dielectric patterning |
Magdy S. Abdelrahman |
2010-01-19 |
| 7554347 |
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use |
Hiren D. Thacker, Muhannad Bakir, James D. Meindl, Thomas K. Gaylord, Kevin P. Martin +1 more |
2009-06-30 |
| 7016569 |
Back-side-of-die, through-wafer guided-wave optical clock distribution networks, method of fabrication thereof, and uses thereof |
James D. Meindl, Thomas K. Gaylord |
2006-03-21 |
| 6954576 |
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package |
Chirag S. Patel, James D. Meindl, Thomas K. Gaylord, Elias N. Glytsis, Kevin P. Martin +4 more |
2005-10-11 |
| 6947651 |
Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof |
Paul A. Kohl, James D. Meindl, Agnes Padovani, Thomas K. Gaylord, Elias N. Glytsis +1 more |
2005-09-20 |
| 6807352 |
Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof |
James D. Meindl, Thomas K. Gaylord, Elias N. Glytsis, Paul A. Kohl |
2004-10-19 |
| 6788867 |
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication |
James D. Meindl, Paul A. Kohl, Stephen M. Schultz, Thomas K. Gaylord, Elias N. Glytsis +3 more |
2004-09-07 |
| 6785458 |
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package |
Chirag S. Patel, James D. Meindl, Thomas K. Gaylord, Elias N. Glytsis, Kevin P. Martin +4 more |
2004-08-31 |