JM

James D. Meindl

GR Georgia Tech Research: 21 patents #19 of 2,755Top 1%
BU Board Of Trustees Leland Stanford Jr University: 1 patents #50 of 153Top 35%
Overall (All Time): #197,597 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8563365 Air-gap C4 fluidic I/O interconnects and methods of fabricating same Calvin Richard King, Jr., Jesal Zevari, Muhannad Bakir 2013-10-22
7994590 High dielectric constant insulators and associated fabrication methods Thomas K. Gaylord 2011-08-09
7935459 Photo-masks and methods of fabricating surface-relief grating diffractive devices Thomas K. Gaylord, Justin L. Stay, Jonathan S. Maikisch 2011-05-03
7928563 3-D ICs with microfluidic interconnects and methods of constructing same Muhannad Bakir, Deepak C. Sekar, Bing Dang, Calvin Richard King, Jr. 2011-04-19
7906255 Photo-masks and methods of fabricating periodic optical structures Thomas K. Gaylord, Justin L. Stay 2011-03-15
7554347 High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use Tony Mule, Hiren D. Thacker, Muhannad Bakir, Thomas K. Gaylord, Kevin P. Martin +1 more 2009-06-30
7468558 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof Muhannad Bakir, Kevin P. Martin 2008-12-23
7348786 Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication Hiren D. Thacker, Oluwafemi O. Ogunsola 2008-03-25
7266267 Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereof Muhannad Bakir 2007-09-04
7135777 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof Muhannad Bakir 2006-11-14
7132736 Devices having compliant wafer-level packages with pillars and methods of fabrication Muhannad Bakir, Chirag S. Patel 2006-11-07
7099525 Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereof Muhannad Bakir, Kevin P. Martin 2006-08-29
7016569 Back-side-of-die, through-wafer guided-wave optical clock distribution networks, method of fabrication thereof, and uses thereof Tony Mule, Thomas K. Gaylord 2006-03-21
6954576 Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package Tony Mule, Chirag S. Patel, Thomas K. Gaylord, Elias N. Glytsis, Kevin P. Martin +4 more 2005-10-11
6947651 Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof Tony Mule, Paul A. Kohl, Agnes Padovani, Thomas K. Gaylord, Elias N. Glytsis +1 more 2005-09-20
6807352 Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof Tony Mule, Thomas K. Gaylord, Elias N. Glytsis, Paul A. Kohl 2004-10-19
6788867 Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication Tony Mule, Paul A. Kohl, Stephen M. Schultz, Thomas K. Gaylord, Elias N. Glytsis +3 more 2004-09-07
6785458 Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package Tony Mule, Chirag S. Patel, Thomas K. Gaylord, Elias N. Glytsis, Kevin P. Martin +4 more 2004-08-31
6690081 Compliant wafer-level packaging devices and methods of fabrication Muhannad Bakir, Hollie Reed, Paul A. Kohl, Chirag S. Patel, Kevin P. Martin 2004-02-10
6606432 Phase mask consisting of an array of multiple diffractive elements for simultaneous accurate fabrication of large arrays of optical couplers and method for making same Thomas K. Gaylord, Elias N. Glytsis 2003-08-12
6528349 Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testability Chirag S. Patel, Kevin P. Martin 2003-03-04
4285001 Monolithic distributed resistor-capacitor device and circuit utilizing polycrystalline semiconductor material Levy Gerzberg 1981-08-18