Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6891275 | Method for accommodating small minimum die in wire bonded area array packages | Ryan David Lane, Edward Reyes, Mark Veatch | 2005-05-10 | $126,590,000 |
| 6762495 | Area array package with non-electrically connected solder balls | Edward Reyes, Ryan David Lane, Tiona Marburger | 2004-07-13 | $120,526,000 |