Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605594 | Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate | Ryan David Lane, Li-Sheng Weng, Charles David Paynter | 2023-03-14 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605594 | Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate | Ryan David Lane, Li-Sheng Weng, Charles David Paynter | 2023-03-14 |