Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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William Stone — 21 Patents

TETemptronic: 8 patents #2 of 25Top 8%
Qualcomm: 6 patents #2,934 of 12,104Top 25%
BEBeloit: 2 patents #99 of 209Top 50%
LGLeybold-Heraeus Gmbh: 1 patents #95 of 219Top 45%
SCScope Co: 1 patents #3 of 6Top 50%
TETechnic: 1 patents #22 of 42Top 55%
San Diego, CA: #2,009 of 23,606 inventorsTop 9%
California: #27,449 of 386,348 inventorsTop 8%
Overall (All Time): #201,324 of 4,157,543Top 5%
21 Patents All Time
William Stone has been granted 21 US patents while listed as an inventor at Temptronic. The first was granted in 1982 and the most recent in February 2025. William Stone ranks #201,324 of 4,157,543 US inventors in our database (top 4.8%). Patent records list William Stone in San Diego, CA, US.

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12218041 Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods Jihong Choi, Giridhar Nallapati, Jianwen Xu, Jonghae Kim, Periannan Chidambaram +1 more 2025-02-04
11784157 Package comprising integrated devices coupled through a metallization layer Li-Sheng Weng, Charles David Paynter, Ryan David Lane, Jianwen Xu 2023-10-10 $11,761,000
10483218 Integrated circuit (IC) devices with varying diameter via layer 2019-11-19 $11,666,000
10347592 Integrated circuit (IC) devices with varying diameter via layer 2019-07-09 $18,350,000
10002857 Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer Michael James Solimando, John Holmes, Christopher J. Healy, Rajendra D. Pendse, Sun Hyuck Yun 2018-06-19 $14,516,000
9318405 Wafer level package without sidewall cracking Jianwen Xu, Lizabeth Keser, Steve Joseph Bezuk, Nicholas Yu 2016-04-19 $8,352,000
7331097 Method of manufacturing a workpiece chuck Robert Lopez 2008-02-19
6969830 Wafer chuck having thermal plate with interleaved heating and cooling elements Kenneth M. Cole, Sr., Douglas S. Olsen 2005-11-29
6867611 Temperature-controlled thermal platform for automated testing 2005-03-15
6744270 Temperature-controlled thermal platform for automated testing 2004-06-01
6700099 Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfaces Kenneth M. Cole, Sr., Douglas S. Olsen 2004-03-02
6375176 Workpiece chuck with guard layer having vacuum distribution pattern Paul Getchel, Kenneth M. Cole, Sr., Henry A. Lyden, Robert Lopez, Thomas Schey +1 more 2002-04-23
6328096 Workpiece chuck Robert Lopez 2001-12-11
6132583 Shielding method and apparatus for use in electroplating process 2000-10-17
6019164 Workpiece chuck Paul Getchel, Kenneth M. Cole, Sr., Henry A. Lyden, Robert Lopez, Thomas Schey +1 more 2000-02-01
5878975 Winder rider roll assembly Gerald A. Guild 1999-03-09
5644839 Surface mountable substrate edge terminal 1997-07-08 $1,120,000
5509197 Method of making substrate edge connector 1996-04-23 $873,000
5213649 Apparatus for receiving and cutting a continuous web David Sepavich 1993-05-25
4677273 Electron beam welding apparatus Russell K. Colegrove 1987-06-30
4346453 Item display order picking system Raoul East Drapeau 1982-08-24 $28,000