Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300655 | Integrated circuit assembly with hybrid bonding | Jonghae Kim, Milind Shah, Abdolreza Langari | 2025-05-13 |
| 12218041 | Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods | Jihong Choi, Giridhar Nallapati, William Stone, Jianwen Xu, Jonghae Kim +1 more | 2025-02-04 |
| 12046545 | Hybrid reconstituted substrate for electronic packaging | Jonghae Kim, Milind Shah | 2024-07-23 |
| 11973019 | Deep trench capacitors in an inter-layer medium on an interconnect layer of an integrated circuit die and related methods | Jihong Choi, Stanley Seungchul Song, Giridhar Nallapati | 2024-04-30 |
| 11894366 | Trench capacitor assembly for high capacitance density | Jonghae Kim, Milind Shah | 2024-02-06 |
| 11817379 | Substrate comprising an inductor and a capacitor located in an encapsulation layer | Jonghae Kim, Milind Shah | 2023-11-14 |
| 11689181 | Package comprising stacked filters with a shared substrate cap | Jonghae Kim, Je-Hsiung Lan, Ranadeep Dutta, Milind Shah | 2023-06-27 |
| 11687766 | Artificial neural networks with precision weight for artificial intelligence | Haining Yang | 2023-06-27 |
| 11670614 | Integrated circuit assembly with hybrid bonding | Jonghae Kim, Milind Shah, Abdolreza Langari | 2023-06-06 |
| 11652101 | Trench capacitor assembly for high capacitance density | Jonghae Kim, Milind Shah | 2023-05-16 |
| 11631614 | MIM capacitor with adjustable capacitance via electronic fuses | Jonghae Kim, Jin-Su Ko, Beomsup Kim | 2023-04-18 |
| 11487507 | Multi-bit compute-in-memory (CIM) arrays employing bit cell circuits optimized for accuracy and power efficiency | Ye Lu, Zhongze Wang | 2022-11-01 |
| 11474786 | Fast digital multiply-accumulate (MAC) by fast digital multiplication circuit | Xia Li, Zhongze Wang | 2022-10-18 |
| 11444068 | Three-dimensional (3D) integrated circuit device having a backside power delivery network | Stanley Seungchul Song, Jonghae Kim, Pratyush Kamal | 2022-09-13 |
| 11437379 | Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits | Stanley Seungchul Song, Deepak Sharma, Bharani Chava, Hyeokjin Lim, Peijie Feng +6 more | 2022-09-06 |
| 11417637 | Stacked decoupling capacitors with integration in a substrate | Jonghae Kim, Milind Shah | 2022-08-16 |
| 11340867 | Compute-in-memory (CIM) binary multiplier | Xia Li, Zhongze Wang | 2022-05-24 |
| 11320847 | Voltage regulation integrated circuit (IC) with circuit components in an integrated three-dimensional (3D) inductor core and related methods of fabrication | Jonghae Kim, Ravindra V. Shenoy, Milind Shah, Evgeni Gousev | 2022-05-03 |
| 11310911 | Three-dimensional (3D) integrated circuit (IC) integration of an embedded chip and a preformed metal routing structure | Stanley Seungchul Song, Jonghae Kim | 2022-04-19 |
| 11296670 | Impedance matching transceiver | Jonghae Kim, Milind Shah | 2022-04-05 |
| 11211290 | MIM capacitor with adjustable capacitance via electronic fuses | Jonghae Kim, Jin-Su Ko, Beomsup Kim | 2021-12-28 |
| 11201127 | Device comprising contact to contact coupling of packages | Jonghae Kim, Milind Shah | 2021-12-14 |
| 11189686 | Integrated device coupled to a capacitor structure comprising a trench capacitor | Jonghae Kim, Milind Shah | 2021-11-30 |
| 11158590 | Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC) | Je-Hsiung Lan, Jonghae Kim, Jinseong Kim | 2021-10-26 |
| 11145768 | Trench capacitor component with reduced equivalent series resistance and equivalent series inductance | Jonghae Kim | 2021-10-12 |