Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424518 | Capacitor embedded 3D resonator for broadband filter | Jonghae Kim, Je-Hsiung Lan, Kai Liu | 2025-09-23 |
| 12401326 | Reducing parasitic capacitance | Abdellatif Bellaouar, Chuan-Cheng Cheng | 2025-08-26 |
| 12334903 | Substrate comprising acoustic resonators configured as at least one acoustic filter | Jonghae Kim, Je-Hsiung Lan | 2025-06-17 |
| 12283607 | 3D inductor design using bundle substrate vias | Jonghae Kim, Je-Hsiung Lan | 2025-04-22 |
| 12255381 | Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods | Jonghae Kim, Je-Hsiung Lan | 2025-03-18 |
| 12046530 | Thermal bridge interposer structure | Je-Hsiung Lan, Jonghae Kim | 2024-07-23 |
| 11984874 | Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods | Jonghae Kim, Je-Hsiung Lan | 2024-05-14 |
| 11862367 | ESL-less AC resistor for high frequency applications | Jonghae Kim, Sang-June Park, Je-Hsiung Lan | 2024-01-02 |
| 11791226 | Device on ceramic substrate | Je-Hsiung Lan, Jonghae Kim | 2023-10-17 |
| 11749746 | Radio frequency front end (RFFE) hetero-integration | Jonghae Kim, Je-Hsiung Lan | 2023-09-05 |
| 11689181 | Package comprising stacked filters with a shared substrate cap | Jonghae Kim, Je-Hsiung Lan, Milind Shah, Periannan Chidambaram | 2023-06-27 |
| 11652064 | Integrated device with electromagnetic shield | Jonghae Kim, Je-Hsiung Lan | 2023-05-16 |
| 11626236 | Stacked inductor having a discrete metal-stack pattern | Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan | 2023-04-11 |
| 11605620 | Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding | Je-Hsiung Lan, Jonghae Kim | 2023-03-14 |
| 11437367 | Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter | Je-Hsiung Lan, Jonghae Kim | 2022-09-06 |
| 11404345 | Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path | Je-Hsiung Lan, Jonghae Kim | 2022-08-02 |
| 11393789 | Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bonding | Je-Hsiung Lan, Jonghae Kim | 2022-07-19 |
| 11394360 | Resonator device | Je-Hsiung Lan, Jonghae Kim | 2022-07-19 |
| 11380678 | Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration | Je-Hsiung Lan, Jonghae Kim | 2022-07-05 |
| 11355617 | Self-aligned collector heterojunction bipolar transistor (HBT) | Stephen Alan FANELLI, Richard Hammond | 2022-06-07 |
| 11336251 | Device with 3D inductor and magnetic core in substrate | Je-Hsiung Lan, Jonghae Kim | 2022-05-17 |
| 11152272 | Die-to-wafer hybrid bonding with forming glass | Je-Hsiung Lan, Jonghae Kim | 2021-10-19 |
| 11024728 | Monolithic self-aligned heterojunction bipolar transistor (HBT) and complementary metal-oxide-semiconductor (CMOS) | — | 2021-06-01 |
| 10950721 | Self-aligned high voltage transistor | — | 2021-03-16 |
| 10748891 | Electrostatic discharge (ESD) robust transistor | — | 2020-08-18 |