| 12512593 |
Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methods |
Joo-In Kim, Jeng-Yin Lan |
2025-12-30 |
|
| 12424518 |
Capacitor embedded 3D resonator for broadband filter |
Jonghae Kim, Je-Hsiung Lan, Kai Liu |
2025-09-23 |
|
| 12401326 |
Reducing parasitic capacitance |
Abdellatif Bellaouar, Chuan-Cheng Cheng |
2025-08-26 |
|
| 12334903 |
Substrate comprising acoustic resonators configured as at least one acoustic filter |
Jonghae Kim, Je-Hsiung Lan |
2025-06-17 |
|
| 12283607 |
3D inductor design using bundle substrate vias |
Jonghae Kim, Je-Hsiung Lan |
2025-04-22 |
|
| 12255381 |
Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods |
Jonghae Kim, Je-Hsiung Lan |
2025-03-18 |
|
| 12046530 |
Thermal bridge interposer structure |
Je-Hsiung Lan, Jonghae Kim |
2024-07-23 |
$12,759,000 |
| 11984874 |
Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods |
Jonghae Kim, Je-Hsiung Lan |
2024-05-14 |
$21,127,000 |
| 11862367 |
ESL-less AC resistor for high frequency applications |
Jonghae Kim, Sang-June Park, Je-Hsiung Lan |
2024-01-02 |
$10,990,000 |
| 11791226 |
Device on ceramic substrate |
Je-Hsiung Lan, Jonghae Kim |
2023-10-17 |
$7,437,000 |
| 11749746 |
Radio frequency front end (RFFE) hetero-integration |
Jonghae Kim, Je-Hsiung Lan |
2023-09-05 |
$8,300,000 |
| 11689181 |
Package comprising stacked filters with a shared substrate cap |
Jonghae Kim, Je-Hsiung Lan, Milind Shah, Periannan Chidambaram |
2023-06-27 |
$11,184,000 |
| 11652064 |
Integrated device with electromagnetic shield |
Jonghae Kim, Je-Hsiung Lan |
2023-05-16 |
$10,470,000 |
| 11626236 |
Stacked inductor having a discrete metal-stack pattern |
Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan |
2023-04-11 |
$12,775,000 |
| 11605620 |
Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding |
Je-Hsiung Lan, Jonghae Kim |
2023-03-14 |
$15,604,000 |
| 11437367 |
Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter |
Je-Hsiung Lan, Jonghae Kim |
2022-09-06 |
$16,070,000 |
| 11404345 |
Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path |
Je-Hsiung Lan, Jonghae Kim |
2022-08-02 |
$22,443,000 |
| 11393789 |
Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bonding |
Je-Hsiung Lan, Jonghae Kim |
2022-07-19 |
$22,075,000 |
| 11394360 |
Resonator device |
Je-Hsiung Lan, Jonghae Kim |
2022-07-19 |
$22,075,000 |
| 11380678 |
Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration |
Je-Hsiung Lan, Jonghae Kim |
2022-07-05 |
$23,532,000 |
| 11355617 |
Self-aligned collector heterojunction bipolar transistor (HBT) |
Stephen Alan FANELLI, Richard Hammond |
2022-06-07 |
$19,026,000 |
| 11336251 |
Device with 3D inductor and magnetic core in substrate |
Je-Hsiung Lan, Jonghae Kim |
2022-05-17 |
$28,775,000 |
| 11152272 |
Die-to-wafer hybrid bonding with forming glass |
Je-Hsiung Lan, Jonghae Kim |
2021-10-19 |
$19,681,000 |
| 11024728 |
Monolithic self-aligned heterojunction bipolar transistor (HBT) and complementary metal-oxide-semiconductor (CMOS) |
— |
2021-06-01 |
$22,362,000 |
| 10950721 |
Self-aligned high voltage transistor |
— |
2021-03-16 |
$35,385,000 |
