Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12342595 | Transistor cell with self-aligned gate contact | Junjing Bao, John Jianhong Zhu | 2025-06-24 |
| 12218041 | Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods | Jihong Choi, William Stone, Jianwen Xu, Jonghae Kim, Periannan Chidambaram +1 more | 2025-02-04 |
| 11973019 | Deep trench capacitors in an inter-layer medium on an interconnect layer of an integrated circuit die and related methods | Jihong Choi, Stanley Seungchul Song, Periannan Chidambaram | 2024-04-30 |
| 11973020 | Metal-insulator-metal capacitor with top contact | John Jianhong Zhu, Lixin Ge | 2024-04-30 |
| 11942414 | Integrated circuits (ICs) employing directly coupled metal lines between vertically-adjacent interconnect layers for reduced coupling resistance, and related methods | John Jianhong Zhu, Junjing Bao | 2024-03-26 |
| 11437379 | Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits | Stanley Seungchul Song, Deepak Sharma, Bharani Chava, Hyeokjin Lim, Peijie Feng +6 more | 2022-09-06 |
| 11404373 | Hybrid low resistance metal lines | Junjing Bao, John Jianhong Zhu | 2022-08-02 |
| 10847507 | Contact liner to enable different CPP devices | Junjing Bao, Stanley Seungchul Song, Jie Deng | 2020-11-24 |
| 10686031 | Finger metal-oxide-metal (FMOM) capacitor | Peijie Feng, Junjing Bao, Ye Lu | 2020-06-16 |
| 10651122 | Integrated circuit (IC) interconnect structure having a metal layer with asymmetric metal line-dielectric structures supporting self-aligned vertical interconnect accesses (VIAS) | Junjing Bao, Periannan Chidambaram | 2020-05-12 |
| 10636737 | Structure and method of metal wraparound for low via resistance | Junjing Bao, Jie Deng, John Jianhong Zhu | 2020-04-28 |
| 10418244 | Modified self-aligned quadruple patterning (SAQP) processes using cut pattern masks to fabricate integrated circuit (IC) cells with reduced area | Stanley Seungchul Song, Periannan Chidambaram | 2019-09-17 |
| 10325979 | High density and reliable vertical natural capacitors | Junjing Bao, Jun Chen, Yangyang SUN, Stanley Seungchul Song | 2019-06-18 |
| 10291211 | Adaptive pulse generation circuits for clocking pulse latches with minimum hold time | Stanley Seungchul Song, Seong-Ook Jung, Hanwool Jeong, Tae Woo Oh, Periannan Chidambaram | 2019-05-14 |
| 10247617 | Middle-of-line (MOL) metal resistor temperature sensors for localized temperature sensing of active semiconductor areas in integrated circuits (ICs) | Lixin Ge, Periannan Chidambaram, Bin Yang, Jiefeng Lin, Bo Yu +3 more | 2019-04-02 |
| 9818817 | Metal-insulator-metal capacitor over conductive layer | John Jianhong Zhu, P R Chidambaram, Choh Fei Yeap | 2017-11-14 |
| 9287347 | Metal-insulator-metal capacitor under redistribution layer | John Jianhong Zhu, P R Chidambaram, Choh Fei Yeap | 2016-03-15 |
| 9245971 | Semiconductor device having high mobility channel | Bin Yang, P R Chidambaram, John Jianhong Zhu, Jihong Choi, Da Yang +4 more | 2016-01-26 |
| 9070551 | Method and apparatus for a diffusion bridged cell library | Benjamin J. Bowers, James W. Hayward, Charanya Gopal, Gregory Christopher Burda, Robert J. Bucki +3 more | 2015-06-30 |
| 9024418 | Local interconnect structures for high density | John Jianhong Zhu, PR Chidambaram | 2015-05-05 |
| 8836040 | Shared-diffusion standard cell architecture | Pratyush Kamal, Esin Terzioglu, Foua Vang, Prayag Bhanubhai Patel, Animesh Datta | 2014-09-16 |
| 8782576 | Method and apparatus for a diffusion bridged cell library | Benjamin J. Bowers, James W. Hayward, Charanya Gopal, Gregory Christopher Burda, Robert J. Bucki +3 more | 2014-07-15 |