Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002857 | Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer | William Stone, John Holmes, Christopher J. Healy, Rajendra D. Pendse, Sun Hyuck Yun | 2018-06-19 |