Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11960813 | Automatic redistribution layer via generation | Rajagopalan Venkatramani, Renato Dimatula Gaddi, Warren Alexander Santos, Dennis Glenn Lozanta Surell | 2024-04-16 |
| 9607935 | Semiconductor chip package with undermount passive devices | Neil McLellan, Silqun Leung, Gabriel Wong | 2017-03-28 |
| 9209106 | Thermal management circuit board for stacked semiconductor chip device | Xiao Ling Shi, Suming Hu, Roden R. Topacio, Terence Cheung | 2015-12-08 |
| 8637983 | Face-to-face (F2F) hybrid structure for an integrated circuit | Roden R. Topacio, Yip Seng Low | 2014-01-28 |
| 8564122 | Circuit board component shim structure | Neil McLellan, Yip Seng Low, Suming Hu | 2013-10-22 |
| 8298945 | Method of manufacturing substrates having asymmetric buildup layers | Andrew KW Leung, Roden R. Topacio, Yip Seng Low | 2012-10-30 |
| 8012874 | Semiconductor chip substrate with multi-capacitor footprint | Yue Li, Silqun Leung, Terence Cheung, Sally Yeung | 2011-09-06 |
| 7847568 | Multi-site probe | Andrew Gangoso | 2010-12-07 |