{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "AMD", "item": "https://www.patentleaderboard.com/company/amd"}, {"@type": "ListItem", "position": 3, "name": "Liane Martinez", "item": "https://www.patentleaderboard.com/inventor/fl:li_ln:martinez-10"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
LM

Liane Martinez — 9 Patents

AMD: 13 patents #992 of 9,280Top 15%
Tisdale, CA: #3 of 30 inventorsTop 10%
Overall (All Time): #535,341 of 4,157,543Top 15%
9 Patents All Time
Liane Martinez has been granted 9 US patents while listed as an inventor at AMD. The first was granted in 2010 and the most recent in December 2025. Liane Martinez ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Liane Martinez in Tisdale, SK, CA.

Patents per Year

Patents granted per year, 2010 to 2024Bar chart with a peak of 1 patents in 2010.peak 12010: 1 patents20102011: 1 patents20112012: 1 patents20122013: 1 patents20132014: 1 patents20142015: 1 patents20152017: 1 patents20172024: 1 patents2024

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12499300 Systems and methods for generating a floorplan and bump placement for a package design Rajagopalan Venkatramani, Gabriel Wong, Renato Dimatula Gaddi 2025-12-16
11960813 Automatic redistribution layer via generation Rajagopalan Venkatramani, Renato Dimatula Gaddi, Warren Alexander Santos, Dennis Glenn Lozanta Surell 2024-04-16 $289,510,000
9607935 Semiconductor chip package with undermount passive devices Neil McLellan, Silqun Leung, Gabriel Wong 2017-03-28
9209106 Thermal management circuit board for stacked semiconductor chip device Xiao Ling Shi, Suming Hu, Roden R. Topacio, Terence Cheung 2015-12-08
8637983 Face-to-face (F2F) hybrid structure for an integrated circuit Roden R. Topacio, Yip Seng Low 2014-01-28
8564122 Circuit board component shim structure Neil McLellan, Yip Seng Low, Suming Hu 2013-10-22 $1,818,000
8298945 Method of manufacturing substrates having asymmetric buildup layers Andrew KW Leung, Roden R. Topacio, Yip Seng Low 2012-10-30
8012874 Semiconductor chip substrate with multi-capacitor footprint Yue Li, Silqun Leung, Terence Cheung, Sally Yeung 2011-09-06
7847568 Multi-site probe Andrew Gangoso 2010-12-07 $9,238,000