Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417994 | Semiconductor chip having stepped conductive pillars | Farshad Ghahghahi | 2025-09-16 |
| 11955447 | Semiconductor chip having stepped conductive pillars | Farshad Ghahghahi | 2024-04-09 |
| 11335659 | Semiconductor chip with patterned underbump metallization and polymer film | Roden R. Topacio, Yip Seng Low | 2022-05-17 |
| 11315883 | Integrated circuit product customizations for identification code visibility | Roden R. Topacio, Farshad Ghahghahi, Jianguo Li, Andrew Kwan Wai Leung | 2022-04-26 |
| 9867282 | Circuit board with corner hollows | Neil McLellan, Andrew Kwan Wai Leung, Jianguo Li | 2018-01-09 |
| 9576923 | Semiconductor chip with patterned underbump metallization and polymer film | Roden R. Topacio, Yip Seng Low | 2017-02-21 |
| 9209106 | Thermal management circuit board for stacked semiconductor chip device | Xiao Ling Shi, Liane Martinez, Roden R. Topacio, Terence Cheung | 2015-12-08 |
| 8564122 | Circuit board component shim structure | Neil McLellan, Liane Martinez, Yip Seng Low | 2013-10-22 |