Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335659 | Semiconductor chip with patterned underbump metallization and polymer film | Roden R. Topacio, Suming Hu | 2022-05-17 |
| 9793199 | Circuit board with via trace connection and method of making the same | Andrew KW Leung, Neil McLellan | 2017-10-17 |
| 9576923 | Semiconductor chip with patterned underbump metallization and polymer film | Roden R. Topacio, Suming Hu | 2017-02-21 |
| 8772083 | Solder mask with anchor structures | Andrew KW Leung, Roden R. Topacio, Yu-Ling Hsieh | 2014-07-08 |
| 8637983 | Face-to-face (F2F) hybrid structure for an integrated circuit | Liane Martinez, Roden R. Topacio | 2014-01-28 |
| 8564122 | Circuit board component shim structure | Neil McLellan, Liane Martinez, Suming Hu | 2013-10-22 |
| 8298945 | Method of manufacturing substrates having asymmetric buildup layers | Andrew KW Leung, Roden R. Topacio, Liane Martinez | 2012-10-30 |
| 8294266 | Conductor bump method and apparatus | Roden R. Topacio, Neil McLellan, Andrew KW Leung | 2012-10-23 |
| 7906424 | Conductor bump method and apparatus | Roden R. Topacio, Neil McLellan, Andrew KW Leung | 2011-03-15 |