Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381172 | Semiconductor package and fabricating method thereof | Dae Hee Lee, Tae Ho Ko | 2025-08-05 |
| 11195790 | Fan-out semiconductor package | Akihisa Kuroyanagi, Eun Sil Kim, Yeong A Kim | 2021-12-07 |
| 11043449 | Semiconductor package | Ha Kyeong Lee, Hyun Mi Kang | 2021-06-22 |
| 10854528 | Semiconductor package including organic interposer | Akihisa Kuroyanagi, Yeong A Kim, Eun Sil Kim | 2020-12-01 |
| 10847476 | Semiconductor package | Jae-Kul Lee, Seon Ho Lee | 2020-11-24 |
| 10692791 | Electronic component package with electromagnetic wave shielding | Akihisa Kuroyanagi, Jae-Kul Lee | 2020-06-23 |
| 10541187 | Semiconductor package including organic interposer | Akihisa Kuroyanagi, Yeong A Kim, Eun Sil Kim | 2020-01-21 |
| 10504836 | Fan-out semiconductor package | Akihisa Kuroyanagi, Eun Sil Kim, Yeong A Kim | 2019-12-10 |
| 10475776 | Fan-out semiconductor package module | Yeong A Kim, Eun Sil Kim, Young Gwan Ko, Akihisa Kuroyanagi, Jin Su Kim | 2019-11-12 |
| 9521756 | Power module package and method of fabricating the same | Young Ki Lee, Sun Woo Yun | 2016-12-13 |
| 9305829 | Semiconductor package with an indented portion and manufacturing method thereof | Sung Min Song | 2016-04-05 |
| 9281257 | Semiconductor package including a connecting member | Sung Min Song | 2016-03-08 |