Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195790 | Fan-out semiconductor package | Jun Woo Myung, Eun Sil Kim, Yeong A Kim | 2021-12-07 |
| 10854528 | Semiconductor package including organic interposer | Jun Woo Myung, Yeong A Kim, Eun Sil Kim | 2020-12-01 |
| 10692791 | Electronic component package with electromagnetic wave shielding | Jun Woo Myung, Jae-Kul Lee | 2020-06-23 |
| 10541187 | Semiconductor package including organic interposer | Jun Woo Myung, Yeong A Kim, Eun Sil Kim | 2020-01-21 |
| 10504836 | Fan-out semiconductor package | Jun Woo Myung, Eun Sil Kim, Yeong A Kim | 2019-12-10 |
| 10475776 | Fan-out semiconductor package module | Yeong A Kim, Eun Sil Kim, Young Gwan Ko, Jin Su Kim, Jun Woo Myung | 2019-11-12 |
| 6933618 | Tablet comprising epoxy resin composition | Hisataka Ito, Shinichirou Sudo, Hirofumi Oono | 2005-08-23 |
| 6852263 | Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition | Hisataka Ito, Shinichirou Sudo, Hirofumi Oono | 2005-02-08 |
| 6646063 | Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition | Hisataka Ito, Shinichirou Sudo, Hirofumi Oono | 2003-11-11 |