Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12355000 | Package comprising a substrate and a high-density interconnect integrated device | Yangyang SUN, Li-Sheng Weng | 2025-07-08 |
| 9184167 | Memory cell support lattice | Che-Chi Lee, Brett W. Busch | 2015-11-10 |