Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12345936 | Building control device with a light guide configured for uniformly illuminating a graphical symbol that is visible to a user of the building control device | Chao Chen, Tonya Tang, Rick Han, Qixiang Hu, Harvey Ma +1 more | 2025-07-01 |
| 12347980 | High-speed network connector with integrated magnetics | Kelvin Kun Tang, Simon Shih, Adrian Green | 2025-07-01 |
| 12282187 | Building control device with a light guide configured for uniformly illuminating a graphical symbol that is visible to a user of the building control device | Chao Chen, Rick Han, Tonya Tang, Zhi Yi Sun, Qixiang Hu +3 more | 2025-04-22 |
| 12113038 | Thermal compression flip chip bump for high performance and fine pitch | Dongming He, Hung-Yuan Hsu, Yangyang SUN, Wei Hu, Wei Wang | 2024-10-08 |
| 11948909 | Package comprising spacers between integrated devices | Yangyang SUN, Dongming He | 2024-04-02 |
| 11694982 | Sidewall wetting barrier for conductive pillars | Wei Hu, Dongming He, Wen Yin, Zhe Guan | 2023-07-04 |
| 11557557 | Flip-chip flexible under bump metallization size | Yangyang SUN, Dongming He | 2023-01-17 |
| 8847391 | Non-circular under bump metallization (UBM) structure, orientation of non-circular UBM structure and trace orientation to inhibit peeling and/or cracking | Zhongping Bao, Michael Han | 2014-09-30 |
| RE42457 | Methods of packaging an integrated circuit and methods of forming an integrated circuit package | Dexin Liang | 2011-06-14 |
| RE42332 | Integrated circuit package, ball-grid array integrated circuit package | Dexin Liang | 2011-05-10 |
| 6630737 | Integrated circuit package, ball-grid array integrated circuit package | Dexin Liang | 2003-10-07 |
| 6207476 | Methods of packaging an integrated circuit and methods of forming an integrated circuit package | Dexin Liang | 2001-03-27 |