Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431674 | Power adaption device | Qiping Xiang, Hui Li, Jiazhi Mo, Jiantong Ruan | 2025-09-30 |
| 11469547 | Rotary coupling structure, power supply device and sofa | Qiping Xiang | 2022-10-11 |
| D904300 | Power adapter | Qiping Xiang | 2020-12-08 |
| D895548 | Power adapter | Qiping Xiang | 2020-09-08 |
| 10236715 | Switch power circuit with backup battery for power supply | — | 2019-03-19 |
| RE42457 | Methods of packaging an integrated circuit and methods of forming an integrated circuit package | Lily Zhao | 2011-06-14 |
| RE42332 | Integrated circuit package, ball-grid array integrated circuit package | Lily Zhao | 2011-05-10 |
| 6630737 | Integrated circuit package, ball-grid array integrated circuit package | Lily Zhao | 2003-10-07 |
| 6222260 | Integrated circuit device with integral decoupling capacitor | Ray Killorn | 2001-04-24 |
| 6207476 | Methods of packaging an integrated circuit and methods of forming an integrated circuit package | Lily Zhao | 2001-03-27 |
| 5972734 | Interposer for ball grid array (BGA) package | Karla Y. Carichner | 1999-10-26 |
| 5688606 | Anodized aluminum substrate having increased breakdown voltage | Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock +3 more | 1997-11-18 |
| 5639696 | Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array | Mark R. Schneider | 1997-06-17 |
| 5534356 | Anodized aluminum substrate having increased breakdown voltage | Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock +3 more | 1996-07-09 |
| 5455386 | Chamfered electronic package component | George A. Brathwaite, German Ramirez, Michael A. Holmes, Paul R. Hoffman | 1995-10-03 |
| 5360942 | Multi-chip electronic package module utilizing an adhesive sheet | Paul R. Hoffman | 1994-11-01 |
| 5239131 | Electronic package having controlled epoxy flow | Paul R. Hoffman, Linda E. Strauman, Sonny S. Pareno, German Ramirez | 1993-08-24 |