Dexin Liang — 17 Patents at Olin

Dexin Liang has been granted 17 US patents while listed as an inventor at Olin. The first was granted in 1993 and the most recent in September 2025. Dexin Liang ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Dexin Liang in Huizhou, CA, CN.

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Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12431674	Power adaption device	Qiping Xiang, Hui Li, Jiazhi Mo, Jiantong Ruan	2025-09-30
11469547	Rotary coupling structure, power supply device and sofa	Qiping Xiang	2022-10-11
D904300	Power adapter	Qiping Xiang	2020-12-08
D895548	Power adapter	Qiping Xiang	2020-09-08
10236715	Switch power circuit with backup battery for power supply	—	2019-03-19
RE42457	Methods of packaging an integrated circuit and methods of forming an integrated circuit package	Lily Zhao	2011-06-14
RE42332	Integrated circuit package, ball-grid array integrated circuit package	Lily Zhao	2011-05-10
6630737	Integrated circuit package, ball-grid array integrated circuit package	Lily Zhao	2003-10-07	$1,871,000
6222260	Integrated circuit device with integral decoupling capacitor	Ray Killorn	2001-04-24
6207476	Methods of packaging an integrated circuit and methods of forming an integrated circuit package	Lily Zhao	2001-03-27
5972734	Interposer for ball grid array (BGA) package	Karla Y. Carichner	1999-10-26	$6,392,000
5688606	Anodized aluminum substrate having increased breakdown voltage	Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock +3 more	1997-11-18	$7,997,000
5639696	Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array	Mark R. Schneider	1997-06-17	$9,146,000
5534356	Anodized aluminum substrate having increased breakdown voltage	Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock +3 more	1996-07-09	$10,843,000
5455386	Chamfered electronic package component	George A. Brathwaite, German Ramirez, Michael A. Holmes, Paul R. Hoffman	1995-10-03	$3,634,000
5360942	Multi-chip electronic package module utilizing an adhesive sheet	Paul R. Hoffman	1994-11-01	$958,000
5239131	Electronic package having controlled epoxy flow	Paul R. Hoffman, Linda E. Strauman, Sonny S. Pareno, German Ramirez	1993-08-24	$548,000

Dexin Liang — 17 Patents

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