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— |
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Methods of packaging an integrated circuit and methods of forming an integrated circuit package |
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Integrated circuit package, ball-grid array integrated circuit package |
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Integrated circuit device with integral decoupling capacitor |
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Methods of packaging an integrated circuit and methods of forming an integrated circuit package |
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Interposer for ball grid array (BGA) package |
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| 5688606 |
Anodized aluminum substrate having increased breakdown voltage |
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| 5639696 |
Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array |
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Anodized aluminum substrate having increased breakdown voltage |
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Chamfered electronic package component |
George A. Brathwaite, German Ramirez, Michael A. Holmes, Paul R. Hoffman |
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Multi-chip electronic package module utilizing an adhesive sheet |
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Electronic package having controlled epoxy flow |
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1993-08-24 |
