Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6008532 | Integrated circuit package having bond fingers with alternate bonding areas | — | 1999-12-28 |
| 5972734 | Interposer for ball grid array (BGA) package | Dexin Liang | 1999-10-26 |
| 5550403 | Improved laminate package for an integrated circuit and integrated circuit having such a package | — | 1996-08-27 |