Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5877551 | Semiconductor package having a ground or power ring and a metal substrate | Salvador Tostado, George A. Brathwaite, Paul R. Hoffman, George A. Erfe, Serafin P. Pedron, Jr. +3 more | 1999-03-02 | $4,223,000 |
| 5239131 | Electronic package having controlled epoxy flow | Paul R. Hoffman, Dexin Liang, Sonny S. Pareno, German Ramirez | 1993-08-24 | $548,000 |