Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5877551 | Semiconductor package having a ground or power ring and a metal substrate | Salvador Tostado, Paul R. Hoffman, George A. Erfe, Serafin P. Pedron, Jr., Michael A. Raftery +3 more | 1999-03-02 |
| 5578869 | Components for housing an integrated circuit device | Paul R. Hoffman, Deepak Mahulikar, Dawit Solomon, Arvind Parthasarathi | 1996-11-26 |
| 5506446 | Electronic package having improved wire bonding capability | Paul R. Hoffman, Doanh D. Bui, Deepak Mahulikar | 1996-04-09 |
| 5477008 | Polymer plug for electronic packages | Anthony M. Pasqualoni, Deepak Mahulikar, Francis S. Jewell, Paul R. Hoffman, Richard Paul McNabb +1 more | 1995-12-19 |
| 5455386 | Chamfered electronic package component | German Ramirez, Michael A. Holmes, Paul R. Hoffman, Dexin Liang | 1995-10-03 |