Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12273388 | Cyber risk analysis and remediation using network monitored sensors and methods of use | George Y. Ng, Matthew Honea | 2025-04-08 |
| 12041062 | Systems for securely tracking incident data and automatically generating data incident reports using collaboration rooms with dynamic tenancy | Kevin Gaffney, Paul Meagher, Marlon Rodrigues, Jordan McGrath, Omar Anshasi +3 more | 2024-07-16 |
| 11526825 | Cloud-based multi-tenancy computing systems and methods for providing response control and analytics | Sai Avala, Darragh Buffini, Kevin Gaffney | 2022-12-13 |
| 11265350 | Cyber risk analysis and remediation using network monitored sensors and methods of use | George Y. Ng, Matthew Honea | 2022-03-01 |
| 10404748 | Cyber risk analysis and remediation using network monitored sensors and methods of use | George Y. Ng, Matthew Honea | 2019-09-03 |
| 10341376 | Diversity analysis with actionable feedback methodologies | George Y. Ng | 2019-07-02 |
| 6136460 | Tin coatings incorporating selected elemental additions to reduce discoloration | Szuchain Chen, Julius C. Fister, Dennis R. Brauer, Christopher Laurello | 2000-10-24 |
| 6083633 | Multi-layer diffusion barrier for a tin coated electrical connector | Julius C. Fister, Szuchain Chen, Christoper P. Laurello, Derek E. Tyler | 2000-07-04 |
| 5969414 | Semiconductor package with molded plastic body | Deepak Mahulikar | 1999-10-19 |
| 5952083 | Aluminum alloys for electronic components | Satish Jalota, Jeffrey M. Schlater, Lynn Strauman, Jeffrey S. Braden | 1999-09-14 |
| 5817544 | Enhanced wire-bondable leadframe | — | 1998-10-06 |
| 5688606 | Anodized aluminum substrate having increased breakdown voltage | Deepak Mahulikar, Efraim Sagiv, Satish Jalota, Andrew J. Brock, Michael A. Holmes +3 more | 1997-11-18 |
| 5650663 | Electronic package with improved thermal properties | — | 1997-07-22 |
| 5578869 | Components for housing an integrated circuit device | Paul R. Hoffman, Deepak Mahulikar, George A. Brathwaite, Dawit Solomon | 1996-11-26 |
| 5573845 | Superficial coating layer having acicular structures for electrical conductors | William L. Brenneman | 1996-11-12 |
| 5563442 | Leadframe having exposed, solderable outer lead ends | Deepak Mahulikar | 1996-10-08 |
| 5540378 | Method for the assembly of an electronic package | Deepak Mahulikar | 1996-07-30 |
| 5534356 | Anodized aluminum substrate having increased breakdown voltage | Deepak Mahulikar, Efraim Sagiv, Satish Jalota, Andrew J. Brock, Michael A. Holmes +3 more | 1996-07-09 |
| 5489373 | Aqueous zinc solution resistant to precipitation | — | 1996-02-06 |
| 5449951 | Lead frames with improved adhesion to a polymer | Deepak Mahulikar | 1995-09-12 |
| 5343073 | Lead frames having a chromium and zinc alloy coating | Deepak Mahulikar | 1994-08-30 |
| 5234536 | Process for the manufacture of an interconnect circuit | Jeffrey S. Braden | 1993-08-10 |
| 5156716 | Process for the manufacture of a three layer tape for tape automated bonding | — | 1992-10-20 |
| 4997517 | Multi-metal layer interconnect tape for tape automated bonding | — | 1991-03-05 |
| 4749626 | Whisker resistant tin coatings and baths and methods for making such coatings | Igor V. Kadija, Julius C. Fister, Joseph Winter | 1988-06-07 |