| 12273388 |
Cyber risk analysis and remediation using network monitored sensors and methods of use |
George Y. Ng, Matthew Honea |
2025-04-08 |
|
| 12041062 |
Systems for securely tracking incident data and automatically generating data incident reports using collaboration rooms with dynamic tenancy |
Kevin Gaffney, Paul Meagher, Marlon Rodrigues, Jordan McGrath, Omar Anshasi +3 more |
2024-07-16 |
|
| 11526825 |
Cloud-based multi-tenancy computing systems and methods for providing response control and analytics |
Sai Avala, Darragh Buffini, Kevin Gaffney |
2022-12-13 |
|
| 11265350 |
Cyber risk analysis and remediation using network monitored sensors and methods of use |
George Y. Ng, Matthew Honea |
2022-03-01 |
$40,636,000 |
| 10404748 |
Cyber risk analysis and remediation using network monitored sensors and methods of use |
George Y. Ng, Matthew Honea |
2019-09-03 |
$43,954,000 |
| 10341376 |
Diversity analysis with actionable feedback methodologies |
George Y. Ng |
2019-07-02 |
$48,975,000 |
| 6136460 |
Tin coatings incorporating selected elemental additions to reduce discoloration |
Szuchain Chen, Julius C. Fister, Dennis R. Brauer, Christopher Laurello |
2000-10-24 |
$9,726,000 |
| 6083633 |
Multi-layer diffusion barrier for a tin coated electrical connector |
Julius C. Fister, Szuchain Chen, Christoper P. Laurello, Derek E. Tyler |
2000-07-04 |
|
| 5969414 |
Semiconductor package with molded plastic body |
Deepak Mahulikar |
1999-10-19 |
|
| 5952083 |
Aluminum alloys for electronic components |
Satish Jalota, Jeffrey M. Schlater, Lynn Strauman, Jeffrey S. Braden |
1999-09-14 |
|
| 5817544 |
Enhanced wire-bondable leadframe |
— |
1998-10-06 |
$8,331,000 |
| 5688606 |
Anodized aluminum substrate having increased breakdown voltage |
Deepak Mahulikar, Efraim Sagiv, Satish Jalota, Andrew J. Brock, Michael A. Holmes +3 more |
1997-11-18 |
$7,997,000 |
| 5650663 |
Electronic package with improved thermal properties |
— |
1997-07-22 |
$3,901,000 |
| 5578869 |
Components for housing an integrated circuit device |
Paul R. Hoffman, Deepak Mahulikar, George A. Brathwaite, Dawit Solomon |
1996-11-26 |
$8,990,000 |
| 5573845 |
Superficial coating layer having acicular structures for electrical conductors |
William L. Brenneman |
1996-11-12 |
$9,605,000 |
| 5563442 |
Leadframe having exposed, solderable outer lead ends |
Deepak Mahulikar |
1996-10-08 |
$3,801,000 |
| 5540378 |
Method for the assembly of an electronic package |
Deepak Mahulikar |
1996-07-30 |
$1,920,000 |
| 5534356 |
Anodized aluminum substrate having increased breakdown voltage |
Deepak Mahulikar, Efraim Sagiv, Satish Jalota, Andrew J. Brock, Michael A. Holmes +3 more |
1996-07-09 |
$10,843,000 |
| 5489373 |
Aqueous zinc solution resistant to precipitation |
— |
1996-02-06 |
$2,387,000 |
| 5449951 |
Lead frames with improved adhesion to a polymer |
Deepak Mahulikar |
1995-09-12 |
$3,690,000 |
| 5343073 |
Lead frames having a chromium and zinc alloy coating |
Deepak Mahulikar |
1994-08-30 |
$1,247,000 |
| 5234536 |
Process for the manufacture of an interconnect circuit |
Jeffrey S. Braden |
1993-08-10 |
$644,000 |
| 5156716 |
Process for the manufacture of a three layer tape for tape automated bonding |
— |
1992-10-20 |
$4,820,000 |
| 4997517 |
Multi-metal layer interconnect tape for tape automated bonding |
— |
1991-03-05 |
$2,669,000 |
| 4749626 |
Whisker resistant tin coatings and baths and methods for making such coatings |
Igor V. Kadija, Julius C. Fister, Joseph Winter |
1988-06-07 |
$9,121,000 |