| 11104459 |
Systems for capturing a client vehicle |
Peter O. Sorensen, Matthew Alan Michel, William A. Llorens, David M. Murphy, Michael E. McEachen +1 more |
2021-08-31 |
| 8148808 |
Partitioning of electronic packages |
Elizabeth Logan |
2012-04-03 |
| 6300673 |
Edge connectable metal package |
Paul R. Hoffman, James M. Popplewell |
2001-10-09 |
| 6262477 |
Ball grid array electronic package |
Deepak Mahulikar, Paul R. Hoffman |
2001-07-17 |
| 5952083 |
Aluminum alloys for electronic components |
Arvind Parthasarathi, Satish Jalota, Jeffrey M. Schlater, Lynn Strauman |
1999-09-14 |
| 5629835 |
Metal ball grid array package with improved thermal conductivity |
Deepak Mahulikar, Paul R. Hoffman |
1997-05-13 |
| 5608267 |
Molded plastic semiconductor package including heat spreader |
Deepak Mahulikar, Derek E. Tyler, James M. Popplewell |
1997-03-04 |
| 5504372 |
Adhesively sealed metal electronic package incorporating a multi-chip module |
Jacob Crane, Deepak Mahulikar |
1996-04-02 |
| 5399805 |
Metal electronic package with reduced seal width |
Derek E. Tyler, Deepak Mahulikar, Anthony M. Pasqualoni, Paul R. Hoffman |
1995-03-21 |
| 5367196 |
Molded plastic semiconductor package including an aluminum alloy heat spreader |
Deepak Mahulikar, Szuchain Chen |
1994-11-22 |
| 5324888 |
Metal electronic package with reduced seal width |
Derek E. Tyler, Deepak Mahulikar, Anthony M. Pasqualoni, Paul R. Hoffman |
1994-06-28 |
| 5234536 |
Process for the manufacture of an interconnect circuit |
Arvind Parthasarathi |
1993-08-10 |
| 5132773 |
Carrier ring having first and second ring means with bonded surfaces |
Matthew D. Penry |
1992-07-21 |
| 5073521 |
Method for housing a tape-bonded electronic device and the package employed |
— |
1991-12-17 |
| 5043534 |
Metal electronic package having improved resistance to electromagnetic interference |
Deepak Mahulikar, Stephen P. Noe |
1991-08-27 |
| 5025114 |
Multi-layer lead frames for integrated circuit packages |
— |
1991-06-18 |
| 5013871 |
Kit for the assembly of a metal electronic package |
Deepak Mahulikar, Jacob Crane |
1991-05-07 |
| 4970781 |
Process plate for plastic pin grid array manufacturing |
Kin-Shiung Chang, Thomas A. Armer, George Anderson |
1990-11-20 |