| 8430979 |
Copper alloy containing cobalt, nickel and silicon |
Frank N. Mandigo, Peter W. Robinson, Andreas Boegel, Hans-Achim Kuhn, Frank M. Keppeler +1 more |
2013-04-30 |
|
| 8257515 |
Copper alloy containing cobalt, nickel and silicon |
Frank N. Mandigo, Peter W. Robinson, Andreas Boegel, Hans-Achim Kuhn, Frank M. Keppeler +1 more |
2012-09-04 |
|
| 7182823 |
Copper alloy containing cobalt, nickel and silicon |
Frank N. Mandigo, Peter W. Robinson, Andreas Boegel, Hans-Achim Kuhn, Frank M. Keppeler +1 more |
2007-02-27 |
$6,555,000 |
| 6905782 |
Tarnish deterring tin coating |
Christopher Laurello, Szuchain Chen, Julius C. Fister |
2005-06-14 |
$8,711,000 |
| 6749699 |
Silver containing copper alloy |
Andreas Bogel, Jorg Seeger, Hans-Achim Kuhn, John F. Breedis, Ronald N. Caron |
2004-06-15 |
$3,291,000 |
| 6569543 |
Copper foil with low profile bond enahncement |
William Brenneman, Szuchain Chen |
2003-05-27 |
$7,533,000 |
| 6083633 |
Multi-layer diffusion barrier for a tin coated electrical connector |
Julius C. Fister, Szuchain Chen, Christoper P. Laurello, Arvind Parthasarathi |
2000-07-04 |
|
| 5950064 |
Lead-free shot formed by liquid phase bonding |
Peter W. Robinson, Brian Mravic |
1999-09-07 |
$7,283,000 |
| 5882442 |
Iron modified phosphor-bronze |
Ronald N. Caron, John F. Breedis, W. Gary Watson, William Brenneman, Richard P. Vierod +1 more |
1999-03-16 |
$2,170,000 |
| 5608267 |
Molded plastic semiconductor package including heat spreader |
Deepak Mahulikar, Jeffrey S. Braden, James M. Popplewell |
1997-03-04 |
$11,033,000 |
| 5472796 |
Copper alloy clad for coinage |
John F. Breedis |
1995-12-05 |
$1,600,000 |
| 5399805 |
Metal electronic package with reduced seal width |
Deepak Mahulikar, Anthony M. Pasqualoni, Jeffrey S. Braden, Paul R. Hoffman |
1995-03-21 |
$2,250,000 |
| 5381847 |
Vertical casting process |
Sankaranarayanan Ashok, William G. Watson, Harvey P. Cheskis, George A. List |
1995-01-17 |
$4,943,000 |
| 5324888 |
Metal electronic package with reduced seal width |
Deepak Mahulikar, Anthony M. Pasqualoni, Jeffrey S. Braden, Paul R. Hoffman |
1994-06-28 |
$1,662,000 |
| 5098487 |
Copper alloys for shaped charge liners |
Dennis R. Brauer, Frank N. Mandigo |
1992-03-24 |
$504,000 |
| 5026433 |
Grain refinement of a copper base alloy |
Richard P. Vierod, Harvey P. Cheskis |
1991-06-25 |
$2,893,000 |
| 5015438 |
Extrusion of metals |
Sankaranarayanan Ashok, Harvey P. Cheskis |
1991-05-14 |
$941,000 |
| 5015439 |
Extrusion of metals |
Sankaranarayanan Ashok, Harvey P. Cheskis |
1991-05-14 |
$941,000 |
| 4983219 |
Technique for forming silicon carbide coated porous filters |
Paul D. Tungatt, Harvey P. Cheskis |
1991-01-08 |
$1,874,000 |
| 4772395 |
Silicon carbide coated porous filters |
Paul D. Tungatt, Harvey P. Cheskis |
1988-09-20 |
$4,388,000 |
| 4766813 |
Metal shaped charge liner with isotropic coating |
Joseph Winter |
1988-08-30 |
$4,628,000 |
| RE32596 |
Head top surface measurement utilizing screen parameters in electromagnetic casting |
Peter J. Kindlmann, Gary L. Ungarean, John C. Yarwood |
1988-02-09 |
|
| 4709746 |
Process and apparatus for continuous slurry casting |
Kenneth P. Young, Harvey P. Cheskis, W. Gary Watson |
1987-12-01 |
|
| 4708740 |
Technique for forming silicon carbide coated porous filters |
Paul D. Tungatt, Harvey P. Cheskis |
1987-11-24 |
$3,257,000 |
| 4674557 |
Regulation of the thickness of electromagnetically cast thin strip |
Gerhart K. Gaule, John C. Yarwood, Gary L. Ungarean |
1987-06-23 |
$1,284,000 |