| 10533782 |
Reverse defrost system and methods |
Yonghui Xu |
2020-01-14 |
|
| 5939214 |
Thermal performance package for integrated circuit chip |
Deepak Mahulikar, Abid Khan |
1999-08-17 |
|
| 5504372 |
Adhesively sealed metal electronic package incorporating a multi-chip module |
Jeffrey S. Braden, Deepak Mahulikar |
1996-04-02 |
$10,362,000 |
| 5409552 |
Machinable copper alloys having reduced lead content |
David D. McDevitt, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh |
1995-04-25 |
$2,432,000 |
| 5315155 |
Electronic package with stress relief channel |
Brian E. O'Donnelly, Brian Mravic, Deepak Mahulikar |
1994-05-24 |
$1,794,000 |
| 5288458 |
Machinable copper alloys having reduced lead content |
David D. McDevitt, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh |
1994-02-22 |
$3,694,000 |
| 5236789 |
Palladium alloys having utility in electrical applications |
John G. Cowie, Julius C. Fister |
1993-08-17 |
$1,557,000 |
| 5139891 |
Palladium alloys having utility in electrical applications |
John G. Cowie, Julius C. Fister |
1992-08-18 |
$877,000 |
| 5137685 |
Machinable copper alloys having reduced lead content |
David D. McDevitt, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh |
1992-08-11 |
$1,753,000 |
| 5017244 |
Process for improving the electrical conductivity of a copper-nickel-iron alloy |
Ashok Sankaranarayanan, Julius C. Fister |
1991-05-21 |
$1,794,000 |
| 5015803 |
Thermal performance package for integrated circuit chip |
Deepak Mahulikar, Abid Khan |
1991-05-14 |
$941,000 |
| 5013871 |
Kit for the assembly of a metal electronic package |
Deepak Mahulikar, Jeffrey S. Braden |
1991-05-07 |
$1,994,000 |
| 4897508 |
Metal electronic package |
Deepak Mahulikar, Sheldon H. Butt, Anthony M. Pasqualoni, Edward F. Smith, III |
1990-01-30 |
$4,725,000 |
| 4888449 |
Semiconductor package |
Barry C. Johnson, Deepak Mahulikar, Sheldon H. Butt |
1989-12-19 |
$5,121,000 |
| 4822693 |
Copper-iron-nickel composite material for electrical and electronic applications |
Sankaranarayanan Ashok, Julius C. Fister |
1989-04-18 |
$4,908,000 |
| 4767049 |
Special surfaces for wire bonding |
Sheldon H. Butt, Julius C. Fister |
1988-08-30 |
$4,628,000 |
| 4728363 |
Acicular magnetic particles |
George J. Muench, Yousef Saleh |
1988-03-01 |
$3,166,000 |
| 4698140 |
Techniques for preparing magnetic particles having utility in recording media |
George J. Muench, Yousef Saleh, Lifun Lin |
1987-10-06 |
$6,269,000 |
| 4657583 |
Method of producing ferromagnetic particles |
George J. Muench, Yousef Saleh, Lifun Lin |
1987-04-14 |
$6,529,000 |
| 4434016 |
Precipitation hardenable copper alloy and process |
Yousef Saleh, John F. Breedis |
1984-02-28 |
$946,000 |
| 4202688 |
High conductivity high temperature copper alloy |
Eugene Shapiro, Stanley Shapiro, Brian Mravic |
1980-05-13 |
$1,176,000 |