Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10533782 | Reverse defrost system and methods | Yonghui Xu | 2020-01-14 |
| 5939214 | Thermal performance package for integrated circuit chip | Deepak Mahulikar, Abid Khan | 1999-08-17 |
| 5504372 | Adhesively sealed metal electronic package incorporating a multi-chip module | Jeffrey S. Braden, Deepak Mahulikar | 1996-04-02 |
| 5409552 | Machinable copper alloys having reduced lead content | David D. McDevitt, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh | 1995-04-25 |
| 5315155 | Electronic package with stress relief channel | Brian E. O'Donnelly, Brian Mravic, Deepak Mahulikar | 1994-05-24 |
| 5288458 | Machinable copper alloys having reduced lead content | David D. McDevitt, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh | 1994-02-22 |
| 5236789 | Palladium alloys having utility in electrical applications | John G. Cowie, Julius C. Fister | 1993-08-17 |
| 5139891 | Palladium alloys having utility in electrical applications | John G. Cowie, Julius C. Fister | 1992-08-18 |
| 5137685 | Machinable copper alloys having reduced lead content | David D. McDevitt, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh | 1992-08-11 |
| 5017244 | Process for improving the electrical conductivity of a copper-nickel-iron alloy | Ashok Sankaranarayanan, Julius C. Fister | 1991-05-21 |
| 5015803 | Thermal performance package for integrated circuit chip | Deepak Mahulikar, Abid Khan | 1991-05-14 |
| 5013871 | Kit for the assembly of a metal electronic package | Deepak Mahulikar, Jeffrey S. Braden | 1991-05-07 |
| 4897508 | Metal electronic package | Deepak Mahulikar, Sheldon H. Butt, Anthony M. Pasqualoni, Edward F. Smith, III | 1990-01-30 |
| 4888449 | Semiconductor package | Barry C. Johnson, Deepak Mahulikar, Sheldon H. Butt | 1989-12-19 |
| 4822693 | Copper-iron-nickel composite material for electrical and electronic applications | Sankaranarayanan Ashok, Julius C. Fister | 1989-04-18 |
| 4767049 | Special surfaces for wire bonding | Sheldon H. Butt, Julius C. Fister | 1988-08-30 |
| 4728363 | Acicular magnetic particles | George J. Muench, Yousef Saleh | 1988-03-01 |
| 4698140 | Techniques for preparing magnetic particles having utility in recording media | George J. Muench, Yousef Saleh, Lifun Lin | 1987-10-06 |
| 4657583 | Method of producing ferromagnetic particles | George J. Muench, Yousef Saleh, Lifun Lin | 1987-04-14 |
| 4434016 | Precipitation hardenable copper alloy and process | Yousef Saleh, John F. Breedis | 1984-02-28 |
| 4202688 | High conductivity high temperature copper alloy | Eugene Shapiro, Stanley Shapiro, Brian Mravic | 1980-05-13 |