Sheldon H. Butt — 48 Patents at Olin

Sheldon H. Butt has been granted 48 US patents while listed as an inventor at Olin. The first was granted in 1981 and the most recent in June 1991. Sheldon H. Butt ranks #57,596 of 4,157,543 US inventors in our database (top 1.4%). Patent records list Sheldon H. Butt in Godfrey, IL, US.

Issued Patents All Time

Showing 1–25 of 48 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
5024883	Electronic packaging of components incorporating a ceramic-glass-metal composite	Narendra N. SinghDeo, Deepak Mahulikar	1991-06-18	$2,214,000
5014159	Semiconductor package	—	1991-05-07	$1,994,000
5001546	Clad metal lead frame substrates	—	1991-03-19	$2,462,000
4967260	Hermetic microminiature packages	—	1990-10-30
4961106	Metal packages having improved thermal dissipation	Deepak Mahulikar	1990-10-02	$1,563,000
4897508	Metal electronic package	Deepak Mahulikar, Jacob Crane, Anthony M. Pasqualoni, Edward F. Smith, III	1990-01-30	$4,725,000
4889960	Sealed semiconductor casing	—	1989-12-26	$2,394,000
4888449	Semiconductor package	Jacob Crane, Barry C. Johnson, Deepak Mahulikar	1989-12-19	$5,121,000
4883778	Products formed of a ceramic-glass-metal composite	Narendra N. SinghDeo, Deepak Mahulikar	1989-11-28	$1,529,000
4882236	Rigid magnetic recording disks and method of producing same	Charles W. Smith, Jr., Eugene Shapiro	1989-11-21	$1,091,000
4882212	Electronic packaging of components incorporating a ceramic-glass-metal composite	Narendra N. SinghDeo, Deepak Mahulikar	1989-11-21	$1,091,000
4866571	Semiconductor package	—	1989-09-12	$2,669,000
4862323	Chip carrier	—	1989-08-29	$5,841,000
4853491	Chip carrier	—	1989-08-01	$5,990,000
4851615	Printed circuit board	—	1989-07-25	$2,739,000
4849857	Heat dissipating interconnect tape for use in tape automated bonding	Scott V. Voss	1989-07-18	$2,826,000
4839716	Semiconductor packaging	—	1989-06-13	$1,927,000
RE32942	Low thermal expansivity and high thermal conductivity substrate	—	1989-06-06
4827377	Multi-layer circuitry	—	1989-05-02	$1,783,000
4805009	Hermetically sealed semiconductor package	Michael J. Pryor, Richard A. Eppler, Edward F. Smith, III	1989-02-14	$2,257,000
4796083	Semiconductor casing	Satyam Choudary Cherukuri	1989-01-03	$7,078,000
4784974	Method of making a hermetically sealed semiconductor casing	—	1988-11-15	$1,757,000
4769345	Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor	Satyam Choudary Cherukuri	1988-09-06	$8,703,000
4767049	Special surfaces for wire bonding	Julius C. Fister, Jacob Crane	1988-08-30	$4,628,000
4761518	Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs	William Cann	1988-08-02	$2,198,000

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Sheldon H. Butt — 48 Patents

Issued Patents All Time

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