Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5024883 | Electronic packaging of components incorporating a ceramic-glass-metal composite | Narendra N. SinghDeo, Deepak Mahulikar | 1991-06-18 |
| 5014159 | Semiconductor package | — | 1991-05-07 |
| 5001546 | Clad metal lead frame substrates | — | 1991-03-19 |
| 4967260 | Hermetic microminiature packages | — | 1990-10-30 |
| 4961106 | Metal packages having improved thermal dissipation | Deepak Mahulikar | 1990-10-02 |
| 4897508 | Metal electronic package | Deepak Mahulikar, Jacob Crane, Anthony M. Pasqualoni, Edward F. Smith, III | 1990-01-30 |
| 4889960 | Sealed semiconductor casing | — | 1989-12-26 |
| 4888449 | Semiconductor package | Jacob Crane, Barry C. Johnson, Deepak Mahulikar | 1989-12-19 |
| 4883778 | Products formed of a ceramic-glass-metal composite | Narendra N. SinghDeo, Deepak Mahulikar | 1989-11-28 |
| 4882236 | Rigid magnetic recording disks and method of producing same | Charles W. Smith, Jr., Eugene Shapiro | 1989-11-21 |
| 4882212 | Electronic packaging of components incorporating a ceramic-glass-metal composite | Narendra N. SinghDeo, Deepak Mahulikar | 1989-11-21 |
| 4866571 | Semiconductor package | — | 1989-09-12 |
| 4862323 | Chip carrier | — | 1989-08-29 |
| 4853491 | Chip carrier | — | 1989-08-01 |
| 4851615 | Printed circuit board | — | 1989-07-25 |
| 4849857 | Heat dissipating interconnect tape for use in tape automated bonding | Scott V. Voss | 1989-07-18 |
| 4839716 | Semiconductor packaging | — | 1989-06-13 |
| RE32942 | Low thermal expansivity and high thermal conductivity substrate | — | 1989-06-06 |
| 4827377 | Multi-layer circuitry | — | 1989-05-02 |
| 4805009 | Hermetically sealed semiconductor package | Michael J. Pryor, Richard A. Eppler, Edward F. Smith, III | 1989-02-14 |
| 4796083 | Semiconductor casing | Satyam Choudary Cherukuri | 1989-01-03 |
| 4784974 | Method of making a hermetically sealed semiconductor casing | — | 1988-11-15 |
| 4769345 | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor | Satyam Choudary Cherukuri | 1988-09-06 |
| 4767049 | Special surfaces for wire bonding | Julius C. Fister, Jacob Crane | 1988-08-30 |
| 4761518 | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs | William Cann | 1988-08-02 |