Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4736236 | Tape bonding material and structure for electronic circuit fabrication | — | 1988-04-05 |
| 4682414 | Multi-layer circuitry | — | 1987-07-28 |
| 4659404 | Method of making low thermal expansivity and high thermal conductivity substrate | — | 1987-04-21 |
| 4656499 | Hermetically sealed semiconductor casing | — | 1987-04-07 |
| 4652323 | Plasma deposition applications for communication cables | — | 1987-03-24 |
| 4607276 | Tape packages | — | 1986-08-19 |
| 4594770 | Method of making semiconductor casing | — | 1986-06-17 |
| 4582556 | Adhesion primers for encapsulating epoxies | Edward F. Smith, III, F. Dennis Gyurina | 1986-04-15 |
| 4577056 | Hermetically sealed metal package | — | 1986-03-18 |
| 4570337 | Method of assembling a chip carrier | — | 1986-02-18 |
| 4569692 | Low thermal expansivity and high thermal conductivity substrate | — | 1986-02-11 |
| 4542259 | High density packages | — | 1985-09-17 |
| 4532222 | Reinforced glass composites | — | 1985-07-30 |
| 4525422 | Adhesion primers for encapsulating epoxies | Edward F. Smith, III, F. Dennis Gyurina | 1985-06-25 |
| 4524238 | Semiconductor packages | — | 1985-06-18 |
| 4521469 | Casing for electronic components | Edward F. Smith, III, F. Dennis Gyurina | 1985-06-04 |
| 4491622 | Composites of glass-ceramic to metal seals and method of making the same | — | 1985-01-01 |
| 4480262 | Semiconductor casing | — | 1984-10-30 |
| 4461924 | Semiconductor casing | — | 1984-07-24 |
| 4410927 | Casing for an electrical component having improved strength and heat transfer characteristics | — | 1983-10-18 |
| D265584 | Three tube heat exchanger panel | Charles A. Kleine | 1982-07-27 |
| 4275784 | Fail safe heat exchanger | James M. Popplewell | 1981-06-30 |
| 4246960 | Fail safe heat exchanger | James M. Popplewell | 1981-01-27 |