| 5693706 |
Aromatic tackifier resin |
Steven G. Hentges, Frank Carl Jagisch |
1997-12-02 |
| 5693721 |
Aromatic tackifier resin |
Steven G. Hentges, Frank Carl Jagisch |
1997-12-02 |
| 5656698 |
Aromatic tackifier resin |
Steven G. Hentges, Frank Carl Jagisch |
1997-08-12 |
| 4897508 |
Metal electronic package |
Deepak Mahulikar, Sheldon H. Butt, Jacob Crane, Anthony M. Pasqualoni |
1990-01-30 |
| 4818730 |
Sealing glass composite |
Lewis C. Hoffman |
1989-04-04 |
| 4812896 |
Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant |
Eugene F. Rothgery, William W. C. Hart, Steven D. Phillips, Bonnie B. Sandel, David F. Gavin |
1989-03-14 |
| 4805009 |
Hermetically sealed semiconductor package |
Michael J. Pryor, Richard A. Eppler, Sheldon H. Butt |
1989-02-14 |
| 4801488 |
Sealing glass composite |
— |
1989-01-31 |
| 4775647 |
Sealing glass composite |
— |
1988-10-04 |
| 4752521 |
Sealing glass composite |
Lewis C. Hoffman |
1988-06-21 |
| 4612166 |
Copper-silicon-tin alloys having improved cleanability |
Andrew J. Brock, Eugene Shapiro |
1986-09-16 |
| 4598022 |
One-step plasma treatment of copper foils to increase their laminate adhesion |
Reza Haque, Igor V. Kadija |
1986-07-01 |
| 4588641 |
Three-step plasma treatment of copper foils to enhance their laminate adhesion |
Reza Haque |
1986-05-13 |
| 4582556 |
Adhesion primers for encapsulating epoxies |
Sheldon H. Butt, F. Dennis Gyurina |
1986-04-15 |
| 4526806 |
One-step plasma treatment of copper foils to increase their laminate adhesion |
Reza Haque, Igor V. Kadija |
1985-07-02 |
| 4525422 |
Adhesion primers for encapsulating epoxies |
Sheldon H. Butt, F. Dennis Gyurina |
1985-06-25 |
| 4524089 |
Three-step plasma treatment of copper foils to enhance their laminate adhesion |
Reza Haque |
1985-06-18 |
| 4521469 |
Casing for electronic components |
Sheldon H. Butt, F. Dennis Gyurina |
1985-06-04 |
| 4409295 |
Electrical connector material |
F. Dennis Gyurina |
1983-10-11 |