| 10919634 |
Inert ambient pressure delay |
Patrick Carver |
2021-02-16 |
| 10801822 |
Variable stand-off assembly |
Brian Wilson |
2020-10-13 |
| 6188130 |
Exposed heat spreader with seal ring |
Serafin P. Pedron, Jr. |
2001-02-13 |
| 5877551 |
Semiconductor package having a ground or power ring and a metal substrate |
Salvador Tostado, George A. Brathwaite, Paul R. Hoffman, George A. Erfe, Serafin P. Pedron, Jr. +3 more |
1999-03-02 |
| 5688606 |
Anodized aluminum substrate having increased breakdown voltage |
Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock +3 more |
1997-11-18 |
| 5534356 |
Anodized aluminum substrate having increased breakdown voltage |
Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock +3 more |
1996-07-09 |
| 5477008 |
Polymer plug for electronic packages |
Anthony M. Pasqualoni, Deepak Mahulikar, Francis S. Jewell, Paul R. Hoffman, George A. Brathwaite +1 more |
1995-12-19 |
| 5455386 |
Chamfered electronic package component |
George A. Brathwaite, Michael A. Holmes, Paul R. Hoffman, Dexin Liang |
1995-10-03 |
| 5239131 |
Electronic package having controlled epoxy flow |
Paul R. Hoffman, Linda E. Strauman, Dexin Liang, Sonny S. Pareno |
1993-08-24 |