Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10919634 | Inert ambient pressure delay | Patrick Carver | 2021-02-16 |
| 10801822 | Variable stand-off assembly | Brian Wilson | 2020-10-13 |
| 6188130 | Exposed heat spreader with seal ring | Serafin P. Pedron, Jr. | 2001-02-13 |
| 5877551 | Semiconductor package having a ground or power ring and a metal substrate | Salvador Tostado, George A. Brathwaite, Paul R. Hoffman, George A. Erfe, Serafin P. Pedron, Jr. +3 more | 1999-03-02 |
| 5688606 | Anodized aluminum substrate having increased breakdown voltage | Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock +3 more | 1997-11-18 |
| 5534356 | Anodized aluminum substrate having increased breakdown voltage | Deepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock +3 more | 1996-07-09 |
| 5477008 | Polymer plug for electronic packages | Anthony M. Pasqualoni, Deepak Mahulikar, Francis S. Jewell, Paul R. Hoffman, George A. Brathwaite +1 more | 1995-12-19 |
| 5455386 | Chamfered electronic package component | George A. Brathwaite, Michael A. Holmes, Paul R. Hoffman, Dexin Liang | 1995-10-03 |
| 5239131 | Electronic package having controlled epoxy flow | Paul R. Hoffman, Linda E. Strauman, Dexin Liang, Sonny S. Pareno | 1993-08-24 |