Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749579 | Thermal structures adapted to electronic device heights in integrated circuit (IC) packages | Aniket PATIL, Hong Bok We | 2023-09-05 |
| 11437335 | Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods | Kuiwon Kang, Aniket PATIL, Dongming He | 2022-09-06 |
| 10679919 | High thermal release interposer | Kuiwon Kang, Zhijie Wang | 2020-06-09 |