Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651160 | Low profile integrated package | Kuiwon Kang, Houssam Jomaa, Christopher Bahr | 2020-05-12 |
| 10157824 | Integrated circuit (IC) package and package substrate comprising stacked vias | Kuiwon Kang, Houssam Jomaa, Seongryul Choi | 2018-12-18 |
| 9496213 | Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate | Donald William Kidwell, Jr., Ravindra V. Shenoy, Mete Erturk | 2016-11-15 |
| 9355898 | Package on package (PoP) integrated device comprising a plurality of solder resist layers | Rajneesh Kumar, Houssam Jomaa, David Fraser Rae, Omar J. Bchir | 2016-05-31 |