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Home › Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

US Patent 8508037 · Granted Aug 13, 2013

Estimated economic value: $12,122,000 ⓘ

Assignee

Intel

Inventors

Mathew J. Manusharow (64 patents)
Mark S. Hlad (20 patents)
Ravi Kiran Nalla (49 patents)

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