Patents per Year
Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10734282 | Substrate conductor structure and method | Mihir K. Roy, Mathew J. Manusharow, Mark S. Hlad | 2020-08-04 | $32,661,000 |
| 10312007 | Inductor formed in substrate | Mihir K. Roy, Mathew J. Manusharow | 2019-06-04 | $21,702,000 |
| 10121701 | Substrate conductor structure and method | Mihir K. Roy, Mathew J. Manusharow, Mark S. Hlad | 2018-11-06 | $18,970,000 |
| 9741686 | Electronic package and method of connecting a first die to a second die to form an electronic package | Mathew J. Manusharow, Mihir K. Roy | 2017-08-22 | $8,061,000 |
| 9406587 | Substrate conductor structure and method | Mihir K. Roy, Mathew J. Manusharow, Mark S. Hlad | 2016-08-02 | $8,723,000 |
| 9275975 | Electronic package and method of connecting a first die to a second die to form an electronic package | Mathew J. Manusharow, Mihir K. Roy | 2016-03-01 | $12,287,000 |
| 9198293 | Non-cylindrical conducting shapes in multilayer laminated substrate cores | Mathew J. Manusharow, Mark S. Hlad, Mihir K. Roy | 2015-11-24 | $18,043,000 |