Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package and method of connecting a first die to a second die to form an electronic package

Electronic package and method of connecting a first die to a second die to form an electronic package

US Patent 9275975 · Granted Mar 1, 2016

Estimated economic value: $12,287,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System in package with flip chip die over multi-layer heatsink stanchion2025
Magnetic core inductors in interposer2025
Size and efficiency of dies2024
High density interconnect device and method2024
High density interconnect device and method2024
Package architecture utilizing wafer to wafer bonding2024
Size and efficiency of dies2024
High performance integrated RF passives using dual lithography process2024
High density organic bridge device and method2024
Size and efficiency of dies2024
System in package with flip chip die over multi-layer heatsink stanchion2024
Low loss and low cross talk transmission lines with stacked dielectric layers fo2023