Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11639556 | Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays | Joe Walczyk, Pooya Tadayon, Tanner Schulz | 2023-05-02 |
| 10324112 | Package testing system and method with contact alignment | Mohanraj Prabhugoud, Abram M. Detofsky, Joe Walczyk | 2019-06-18 |