Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Low force liquid metal interconnect solutions

Low force liquid metal interconnect solutions

US Patent 11622466 · Granted Apr 4, 2023

Estimated economic value: $21,090,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Liquid metal interconnect for modular package server architecture2025
Liquid metal interconnect for modular package server architecture2025
Directly impinging pressure modulated spray cooling and methods of target temper2025
Liquid metal interconnect for modular system on an interposer server architectur2025
Liquid metal interconnect for modular system on an interposer server architectur2025
Technologies for chip-to-chip optical data transfer background2025
Reworkable zero-force insertion electrical optical package socket and method2025
Reworkable zero-force insertion electrical optical package socket and method2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Omni directional interconnect with magnetic fillers in mold matrix2025
Hyperchip2025
Die last and waveguide last architecture for silicon photonic packaging2025